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Method for producing rigid and flexible printed circuit board

A technology for printed circuit boards and rigid circuit boards, applied in the fields of printed circuit manufacturing, printed circuit, multi-layer circuit manufacturing, etc., to achieve the effects of excellent reliability, improved adhesion, and stable adhesion

Inactive Publication Date: 2009-07-29
THE FUJIKURA CABLE WORKS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] In the above-mentioned known documents (f) to (i), for the adhesive used for the printed wiring board of the prior art, the type and composition of the adhesive and the implementation of the surface treatment are indeed described, but the optimum Improved adhesion under conditions

Method used

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  • Method for producing rigid and flexible printed circuit board
  • Method for producing rigid and flexible printed circuit board
  • Method for producing rigid and flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] In this example, sodium hydroxide aqueous solution (NaOH (aq)) is used as the chemical solution used in the alkali treatment, and the concentration of the alkali treatment is varied in the range of 0.1 to 10.0 wt%, and the above steps (1) to (5), produced by Figure 1D A flexible rigid three-layer printed circuit board formed as shown. At this time, preparation conditions other than the alkali treatment concentration were made the same. Table 1 summarizes the production conditions. In addition, the printed wiring board produced in this example is called sample A.

[0063] Table 1

[0064] ◆Constituent material of printed circuit board

[Inner layer CCL] Copper foil 18μm on both sides, polyimide 25μm, adhesive 10μm

[Cover Layer (CL)] Polyimide 25μm, Adhesive 25μm

[Outer layer RPC] single-sided copper foil 18μm, epoxy glass 100μm

[Adhesive sheet] 25μm ◆Chemical solution treatment conditions of sample A

[Alkali treatment] concentration: 0...

Embodiment 2

[0073] In this example, sodium hydroxide aqueous solution (NaOH (aq)) is used as the chemical solution used in the alkali treatment, and the time of the alkali treatment is changed in the range of 10 to 600 sec, and the steps (1) to ( 5), produced by Figure 1D A flexible rigid three-layer printed circuit board formed as shown. At this time, the preparation conditions except for the alkali treatment time were made the same. Table 2 summarizes the production conditions. In addition, the printed wiring board produced in this example is called sample B.

[0074] Table 2

[0075] The constituent material of the printed circuit board

[Inner layer CCL] Copper foil 18μm on both sides, polyimide 25μm, adhesive 10μm

[Cover Layer (CL)] Polyimide 25μm, Adhesive 25μm

[Outer layer RPC] single-sided copper foil 18μm, epoxy glass 100μm

[Adhesive sheet] 25μm ◆Chemical solution treatment conditions of sample B

[Alkali treatment] concentration: 1.0[wt%], liqu...

Embodiment 3

[0084] In this example, sodium hydroxide aqueous solution (NaOH (aq)) is used as the chemical solution used in the alkali treatment, and the alkali treatment temperature (liquid temperature) is changed within the range of 15 to 55° C., and the above steps ( 1)~(5), produced the Figure 1D A flexible rigid three-layer printed circuit board formed as shown. At this time, the preparation conditions other than the alkali treatment temperature (liquid temperature) were made the same. Table 3 summarizes the preparation conditions. In addition, the printed wiring board produced in this example is called sample C.

[0085] The same peel strength test as in Example 1 was performed on the sample C prepared by changing the alkali treatment temperature (liquid temperature), and the tensile peel strength (referred to as peel strength) (N / cm) was calculated.

[0086] Figure 5 It is a graph showing the peel strength of sample C produced by changing the alkali treatment temperature (liqu...

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PUM

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Abstract

A method for manufacturing a rigid-flex printed wiring board including an inner-layer flexible wiring board that is formed by laminating a cover lay on an inner-layer copper-clad lamination and has two outer-surfaces of flexible members, outer-layer rigid wiring boards each having one surface of a non-flexible member, and adhesion members, the method including a step &agr; of subjecting the two outer-surfaces of the inner-layer flexible wiring board to an alkaline treatment, and a step &bgr; of stacking the outer-layer rigid wiring boards on each of the two outer-surfaces of the inner-layer flexible wiring board that have been subjected to the alkaline treatment via the adhesion members.

Description

technical field [0001] The present invention relates to a method of manufacturing a flexible rigid printed wiring board, specifically, to a flexible rigid printed wiring board having a structure in which an outer layer RPC sandwiches an inner layer FPC through an adhesive, and the adhesive can exert good bonding strength. A method of manufacturing a rigid printed wiring board. Background technique [0002] First, to the Figure 7A ~D and Figure 8A , B shows a typical cross-sectional view of the flexible rigid (R-F) three-layer printed circuit board as an example, to illustrate the existing general shielding formation process. However, the steps (1) to (8) shown below are general steps, and the steps can be changed back and forth, and the contents are not limited in any way. [0003] (1) For the inner layer CCL110 ( Figure 7A ), process the conductive member 112 to form a circuit 112'. Thus, an inner layer CCL 110' provided with a circuit 112' is obtained ( Figure 7B )...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/36H05K1/03C08J7/00C10G53/12
CPCH05K3/281H05K3/381H05K3/4652H05K3/4691H05K3/4694H05K2203/0793
Inventor 相泽文隆高桥克彦鹤崎幸司
Owner THE FUJIKURA CABLE WORKS LTD
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