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Super-thin plastic key modular and its manufacturing method

A manufacturing method and plastic technology, which can be used in electrical components, electrical switches, circuits, etc., and can solve problems such as inconvenience and missing.

Active Publication Date: 2009-08-19
SILITECH TECH CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. In injection molding manufacturing, it is necessary to design different plastic molds for thin plates of different thicknesses;
[0006] 2. When positioning thin plates, another positioning fixture must be used for appearance processing; and
[0007] 3. When stamping the thin plate at the end, another stamping machine and the use of stamping fixtures must be used
[0008] Therefore, it can be seen from the above that the above-mentioned existing button module and its use method obviously have inconvenience and lack in actual use, and can be improved.

Method used

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  • Super-thin plastic key modular and its manufacturing method
  • Super-thin plastic key modular and its manufacturing method
  • Super-thin plastic key modular and its manufacturing method

Examples

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Embodiment Construction

[0022] see figure 2 As shown, it is a flow chart of the first embodiment of the manufacturing method of the ultra-thin plastic key module of the present invention. As can be seen from the flow chart, the present invention provides a method for manufacturing an ultra-thin plastic key module, the steps of which include: first, providing a thin plate (S200), wherein the thin plate is a plastic material, and the thickness of the thin plate is less than or equal to 1 mm; Next, the thin plate is positioned by an optical positioning module (S202), wherein the optical positioning module has a photosensitive coupling element (CCD) or a complementary metal oxide semiconductor (CMOS) for positioning; then, a computer numerical control is used (Computer Numerical Control, CNC) equipment to process the thin plate into a predetermined shape (S204).

[0023] Next, a plurality of pictures, texts or symbols are arranged on the back of the sheet having a predetermined shape (S206), and the ar...

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PUM

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Abstract

The invention discloses a manufacturing method of an ultra-thin plastic button module. The steps include: first providing a thin plate; then, positioning the thin plate by means of an optical positioning module; and then, using a computer numerical control (CNC) device, The thin plate is processed into a predetermined shape; finally, an elastic body is arranged at the lower end of the thin plate with the predetermined shape. Thereby, through the positioning of the optical positioning module and the processing of the computer numerical control (CNC) equipment, an ultra-thin key body is manufactured. Not only can the overall thickness of the button module be reduced, but also during the production process of the ultra-thin button body, there will be no abnormalities such as deformation of the object, insufficient material, and punching burrs due to restrictions on machine and mold design.

Description

technical field [0001] The invention relates to an ultra-thin plastic key module and a manufacturing method thereof, in particular to an ultra-thin key body through the positioning of an optical positioning module and the processing of computer numerical control (CNC) equipment. Thin plastic key module and method of making the same. Background technique [0002] see figure 1 As shown, it is a flow chart of the manufacturing method of the existing key module. As can be seen from the flow chart, the existing method for manufacturing a key module includes: first, creating a predetermined plastic mold (S100); then, using the plastic mold to form a thin plate (S100) with a required thickness by means of injection molding S102), wherein the thickness is generally greater than 1 mm; then, a jig for positioning the sheet is provided (S104); the appearance of the sheet is processed (S106), such as setting graphics and symbols on the front or back of the sheet; Next, punch the shee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H13/705
Inventor 陈志鸿黄益建练玉燕陈建佳
Owner SILITECH TECH CORP
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