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Semiconductor encapsulation coiling belt

A semiconductor and packaging technology, applied in the field of tape and reel semiconductor packaging tape and reel

Active Publication Date: 2009-09-09
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Another object of the present invention is to overcome the defects of the existing semiconductor packaging structure and provide a new type of semiconductor packaging tape. The technical problem to be solved is to prevent the overload protection circuit from being exposed and polluted, so that it is more practical

Method used

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  • Semiconductor encapsulation coiling belt
  • Semiconductor encapsulation coiling belt
  • Semiconductor encapsulation coiling belt

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no. 1 Embodiment

[0054] Such as figure 1 as shown, figure 1 According to the first specific embodiment of the present invention, it is a partial schematic view of a semiconductor packaging tape. In a first embodiment of the present invention, a semiconductor packaging tape is disclosed for reel-to-reel semiconductor packaging operations. The semiconductor packaging reel mainly includes a reel body 110, a guard ring structure 120 and a plurality of overload protection circuits 130, wherein the overload protection circuit 130 can be any combination of resistors, inductors, capacitors or RLC circuits, Among them, R stands for resistance, L stands for inductance, and C stands for capacitance. Appropriate series or parallel connections can produce different electrical characteristics, so as to accumulate charges and prevent excessive current from destroying the semiconductor packaging tape and the packaged chip. As an electrical buffer mechanism within the reel.

[0055] Such as figure 1 As sho...

no. 4 Embodiment

[0064] In the fourth specific embodiment of the present invention, with reference to Figure 5 , Figure 5 It is a partial schematic diagram of another semiconductor packaging tape according to the fourth specific embodiment of the present invention, revealing another semiconductor packaging tape, which mainly includes a semiconductor packaging tape including a tape body 410, and a plurality of overload protection circuit. In this embodiment, the overload protection circuit is more specifically defined as a flattening capacitor 430, which can be formed by etching a copper foil on the tape body 410 to form parallel lines on the same layer, and connected to the pins of the tape body 410 formed simultaneously. Preferably, dielectric ink can be filled between the parallel lines, which can be the same material or different from the solder resist layer on the surface of the tape body 410 . The reel body 410 has a plurality of use areas 411 , which are generally rectangular, and a...

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Abstract

The invention relates to a semiconductor packaging reel, which mainly includes a reel body, a protection ring structure and a plurality of overload protection circuits. The reel body has a plurality of use areas corresponding to semiconductor packages, and a plurality of external pins are arranged in each use area. The protection ring structure and the overload protection circuit are located outside the use area and connected to each other, and the plurality of connection lines of the protection ring structure are electrically connected to at least a part of the external pins and the overload protection circuit. A plurality of busbars in the protection ring structure make the above-mentioned overload protection circuit connected in parallel. In this way, the electrostatic discharge protection function of the semiconductor packaging tape is improved.

Description

technical field [0001] The invention relates to a tape-and-roll type semiconductor packaging tape, in particular to a semiconductor packaging tape that can improve the protection effect of electrostatic discharge (ESD). Background technique [0002] In the past, COF and TCP tape-and-reel semiconductor packaging products used tape-and-reel transmission for semiconductor packaging operations. During the tape-and-reel transmission process, the semiconductor packaging tape would accumulate static electricity. Once the static electricity was discharged, the internal pins and chips would often be burned. [0003] As disclosed in Taiwan Invention Patent No. I228819 "Semiconductor Package Structure", a protective ring structure is provided around the use area of ​​the semiconductor package tape (ie, the substrate unit) to achieve the effect of electrostatic discharge (ESD) protection. However, this structure can only prevent the static electricity of external machinery, equipment or...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498H01L23/60
Inventor 刘光华
Owner CHIPMOS TECH INC