Device for mounting part

A technology of installation device and motion device, which is applied to electrical components, electrical components and other directions, can solve the problems of large nozzle lifting stroke, large lifting stroke of the first nozzle, and the operation of moving the nozzle downwards is not considered, etc., and saves money. Time, shorten the lifting stroke, high production efficiency

Inactive Publication Date: 2009-10-14
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, since the nozzle does not change in height during movement, there is a problem that the lifting stroke of the nozzle for mounting components is large after the nozzle has reached above the circuit board (for example, see Patent Document 1)
However, the operation of the downward movement of the nozzle is not considered
Therefore, there is a problem that the operation of the up and down movement of the nozzle is not optimized (for example, see Patent Document 2)
However, the height of each nozzle is not considered until the nozzle reaches above the board
Therefore, there is a problem that the lifting stroke of the first nozzle of the mounting member is so large that it does not work unless the device has a plurality of nozzles (for example, see Patent Document 3)
These component cameras 60, nozzle tables 62, reference marks 63, and transport rails 59 are respectively set at desired positions and desired heights, but are not allowed to move easily in order to ensure accuracy.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Figures 1 to 4 A component mounting device according to a first embodiment of the present invention is shown. figure 1 A component mounting device using an XY robot to mount components is shown in . An XY robot 3 (nozzle moving device) driven by an X-axis motor 1 and a Y-axis motor 2 is used. The mounting head 4 coupled to the XY robot 3 is provided movable as desired in a horizontal plane. A nozzle 5 and a Z-axis motor 6 (nozzle lifter) for moving the nozzle 5 up / down as desired are coupled to the mounting head 4 . Electronic components are housed in the component supply unit 7 .

[0043] As a method for fixing the circuit board 8, a pair of opposing transport rails 9 or the like may be employed. One cycle of the electronic component mounting operation includes a component suction operation, a component recognition operation, and a component mounting operation. In the component suction operation, the nozzle 5 moves above the component supply unit 7 and then desc...

Embodiment 2

[0064] Figure 5(a) and 5(b) A component mounting method according to a second embodiment of the present invention is shown. As shown in FIG. 5( a ), it is assumed that an obstacle 33 of a large height is located between the component camera 31 and the mounting position on the circuit board 32 . In this case, when the X-axis motor and the Y-axis motor rotate simultaneously, the nozzle passes along the path of the arrow A, thereby overcoming the obstacle 33 . On the other hand, when the nozzle passes along the path of the arrow B, the nozzle does not clear the obstacle 33 . Therefore, the nozzle can move horizontally without changing the height of the nozzle.

[0065] Fig. 5(b) shows an example of a method of controlling a nozzle path. First, the X-axis motor starts to spin. At time T1, when the X coordinate of the nozzle enters the position X1 outside the obstacle range, the Y-axis motor starts to rotate. Then, if the X-axis has not reached its target position when the Y...

Embodiment 3

[0069] A third embodiment of the present invention will be described below.

[0070] Figure 7 A schematic enlarged perspective view showing an automatic width adjustment mechanism for automatically adjusting the width between transport rails in a component mounting device.

[0071] Parts of the automatic width adjustment mechanism will be described below. The drive motor 34 that can adjust the width of the guide rail is a servo motor. The driving motor 34 with adjustable guide rail width is driven to rotate by the power supply under the control of the above-mentioned computer unit 14 to drive the lead screw 37 through a toothed belt pulley 35 and a gear belt 36 . Therefore, when the driving motor 34 of the adjustable rail width is rotated forward / backward, the movable transport rail 9b can pass through the toothed belt pulley 35, the gear belt 36, the lead screw 37 and the screw nut 38 on the right side perpendicular to the rail. - left direction forward / backward movement ...

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PUM

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Abstract

A device for installing parts, which can improve production efficiency by reducing the movement time of nozzles, the device includes a nozzle lifting device and a control device for controlling the movement position and movement timing of the nozzle movement device, wherein the control The device stores the position and height of the obstacle between the component feeder and the circuit board, and after the electronic component is photographed by the component camera, lowers the nozzle while it has passed the obstacle, or enables the nozzle to avoid the obstacle The route movement of the object. In the component mounting area, the nozzle is moved at the movement height in the component mounting area, and when the component is mounted, the nozzle is lowered from the movement height in the component mounting area. Therefore, the lifting stroke of the nozzle (5) can be reduced. Furthermore, the lifting of the nozzle is performed in an arcuate course.

Description

technical field [0001] The present invention relates to a component mounting device and component mounting method for mounting electronic components on a board. Background technique [0002] In the component delivery height control method according to the background art, the nozzle height is adjusted according to the mounting height of the components mounted on the board and the height of the components sucked by the nozzles. While the nozzle holds and moves the electronic components, the nozzle remains at a fixed height. The heights considered are only those of the electronic components. Especially since the nozzle does not change in height during movement, there is a problem that the lifting stroke of the nozzle for mounting components is large after the nozzle has reached above the circuit board (see Patent Document 1, for example). [0003] In addition, there is another component conveyance height control method in which the movable head is triggered to start horizonta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
Inventor 今福茂树川瀬健之田中阳一奥田修吉武高德木纳俊之
Owner PANASONIC CORP
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