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Multi-layer substrates mutual coupling structure manufacture method and the mutual coupling structure

A multi-layer substrate and connection structure technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as limited rigid system packaging concepts, and achieve the effect of increasing packaging density

Inactive Publication Date: 2009-10-21
PRINCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, basically the packaging technology is still limited to the hard system packaging concept

Method used

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  • Multi-layer substrates mutual coupling structure manufacture method and the mutual coupling structure
  • Multi-layer substrates mutual coupling structure manufacture method and the mutual coupling structure
  • Multi-layer substrates mutual coupling structure manufacture method and the mutual coupling structure

Examples

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no. 1 example

[0033] The first embodiment of the manufacturing method of several multi-layer substrate interconnection structures of the present invention includes the following steps:

[0034] Figure 1A Represents step (a), providing a carrier 102 for forming a multilayer substrate (taking the first multilayer substrate 300 as an example);

[0035] Figure 1B Represents step (b), performing an interface adhesion strengthening process on the carrier plate edge region 119 to increase the adhesion strength between the first dielectric layer 19 corresponding to the end edge 119 of the carrier plate 102 and the carrier plate 102;

[0036] Figure 1C Represents step (c), forming a first metal layer 18 and necessary via holes 9 on the first dielectric layer 19 (shown in Figure 1D ), coating another first dielectric layer 16;

[0037] Figure 1D Represent step (d), repeat step (c), and form the first multi-layer substrate 300, however, the regions 17 and 17-1 in this embodiment are not subj...

no. 4 example

[0055] The fourth embodiment of the manufacturing method of the interconnection structure between several multi-layer substrates of the present invention includes the following steps:

[0056] Figure 4A Represents step (a), providing a carrier 102 for forming a multilayer substrate (taking the first multilayer substrate 300 as an example);

[0057] Figure 4B Represents step (b), carrying out an interfacial adhesion strengthening treatment on the surface of the carrier 102 to increase the adhesion strength between a dielectric layer 104 and the carrier 102, and after hardening the dielectric layer 104, then On the surface on the dielectric layer 104, another dielectric layer 19 is coated;

[0058] Figure 4C Represents step (c), forming a first metal layer 18 and necessary via holes 9 on the dielectric layer (shown in Figure 4D ), coating another first dielectric layer 16;

[0059] Figure 4D Represent step (d), repeat step (c), and form the first multi-layer substrate...

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Abstract

The invention relates to a method for manufacturing an interactive connection structure between multi-layer substrates and the interactive connection structure. The method of the invention comprises the following steps that: at least a dielectric layer and the end margin of a metal layer corresponding to the dielectric layer on each multi-layer substrate are driven to be separated from part of other neighboring dielectric layers and the end margin of the metal layer corresponding to the dielectric layers and the separated end margin of at least one dielectric layer of a multi-layer substrate is stuck on the metal layer of the other multi-layer substrate provided with the separated eng margin so as to accomplish the interactively connected structure between the multi-layer substrates. The interactive connection structure of the invention at least comprises a first multi-layer substrate and a second multi-layer substrate, and at least a first metal layer of the first multi-layer substrate is bound with at least a second metal layer of the second multi-layer substrate so as to form a connection part.

Description

technical field [0001] The invention relates to a method for manufacturing an interactive connection structure between multilayer substrates and the interactive connection structure thereof, in particular to a method for manufacturing an interactive connection structure between multilayer arbitrary types of substrates and the interactive connection structure, which can be applied to flexible packaging And it is suitable for various types of chip components. Background technique [0002] Nowadays, any type of electronic product is becoming increasingly miniaturized. With the continuous reduction of the size of the semiconductor wafer process, the related technologies of the back-end packaging must also develop in the direction of miniaturization. Therefore, the integration level of today's I.C. integrated circuits has been greatly increased, and it is inevitable to use multi-layer substrates to package different types of components and integrate various functions into a high-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/498H01L23/538
CPCH01L2924/0002H01L2924/15311H01L2224/16225
Inventor 杨之光
Owner PRINCO CORP