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Electromagnetic field supply apparatus and plasma processing device

A technology of processing device and supply device, applied in the direction of plasma, connecting device, circuit, etc., can solve the problem that the influence of electromagnetic field cannot be ignored

Inactive Publication Date: 2009-12-23
TOKYO ELECTRON LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even if the struts 328 are formed, for example, using ceramics, their influence on the electromagnetic field in the radial waveguide 321 cannot be ignored if the struts are too thick.

Method used

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  • Electromagnetic field supply apparatus and plasma processing device
  • Electromagnetic field supply apparatus and plasma processing device
  • Electromagnetic field supply apparatus and plasma processing device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0057] figure 1 is a structural diagram of the first embodiment of the present invention. In this figure, the same reference numerals are used to denote the same Figure 20 The same or equivalent parts, and the description of the parts will be omitted appropriately.

[0058] figure 1 The shown plasma processing apparatus includes a processing container 1 and an electromagnetic field supply device 10, wherein the processing container 1 stores substrates 4 such as semiconductors or LCDs as objects to be processed, and performs plasma processing on the substrates 4, The electromagnetic field supply device 10 supplies microwaves MW into the container 1, and generates plasma P in the processing container 1 by the action of the electromagnetic field.

[0059] The electromagnetic field supply device 10 includes a high-frequency power supply 11 that generates microwaves MW at a frequency of 2.45 GHz, a radial line slot antenna (hereinafter abbreviated as RLSA) 12 , and a cylindric...

no. 2 example

[0090] Figure 10 is a sectional view of the main part structure of the second embodiment of the present invention. In this figure, the same reference numerals are used to denote the same figure 1 and Figure 7A ~ Figure 7C The same or equivalent parts, and the description of the parts will be omitted appropriately.

[0091] Figure 10 The shown electromagnetic field supply device has a slope portion 81 widening from the cylindrical waveguide 13 toward the conductor plate 22A at the connection portion between the cylindrical waveguide 13 and the radial waveguide 21 . In addition, a bump 30 is provided at the center of the conductor plate 23 and is formed of a lower layer 31 made of metal and an upper layer 32 made of a dielectric.

[0092] Like the electromagnetic field supply device, by providing the protrusion 30 and at the same time providing the slope portion 81 at the connecting portion of the cylindrical waveguide 13 and the radial waveguide 21, the impedance change...

no. 3 example

[0098] Figure 11 is a structural diagram of the third embodiment of the present invention. In this figure, the same reference numerals are used to denote the same Figure 21 The same or equivalent parts, and the description of the parts will be omitted appropriately.

[0099] Figure 11 The plasma processing apparatus shown has a processing container 101 and an electromagnetic field supply device 110, wherein the processing container 101 is used to store substrates (objects to be processed) 104 such as semiconductors or LCDs, and perform plasma processing on the substrates 104. For processing, the electromagnetic field supply device 110 supplies microwaves MW into the container 101 , and generates plasma P in the processing container 101 by the action of the electromagnetic field.

[0100] The electromagnetic field supply device 110 has a high-frequency power supply 111 that generates microwaves MW at a frequency of 2.45 GHz, a radial line slot antenna (hereinafter abbrevi...

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PUM

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Abstract

The invention discloses an electromagnetic field supply device and a plasma processing device, wherein the electromagnetic field supply device comprises: a waveguide (21), consisting of a first conductor plate (23) having a plurality of slits (26) and a first conductor plate (23) arranged opposite to it. Two conductor plates (22) are formed; the cylindrical waveguide (13) is connected with the opening (25) of the second conductor plate (22); and the protrusion (27) is arranged on the first conductor plate (23) and faces The opening (25) of the second conductor plate (22) protrudes, and at least a part thereof is formed of a dielectric. Transmission loss can be reduced by using a cylindrical waveguide (13) which typically has a higher characteristic impedance than the coaxial waveguide. In addition, by providing the protrusion (27), the power reflection at the connection part of the cylindrical waveguide (13) and the waveguide (21) can be reduced. Accordingly, the supply efficiency of the electromagnetic field can be improved by reducing transmission loss and power reflection.

Description

technical field [0001] The present invention relates to an electromagnetic field supply device, and more specifically, to an electromagnetic field supply device for supplying an electromagnetic field propagating in a waveguide to an object through a slit. [0002] Furthermore, the present invention also relates to a plasma processing apparatus, and more specifically, to a plasma processing apparatus for processing a semiconductor or an object to be processed such as an LCD (liquid crystal display) by generating plasma using an electromagnetic field. Background technique [0003] In the manufacturing process of a semiconductor device or a flat panel display, processes such as formation of an oxide film, crystal growth of a semiconductor layer, etching, and ashing are generally performed using a plasma processing apparatus. Among these plasma processing apparatuses, there is a microwave plasma processing apparatus that supplies microwaves from a radial line slot antenna (herei...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/3065H05H1/46H01P3/12H01J37/32H01P5/02
CPCH01J37/32192H01P5/02H01J37/32266H01L21/18
Inventor 八坂保能安藤真石井信雄筱原己抜
Owner TOKYO ELECTRON LTD