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Exposure device and method for photomask haze reduction via ventilation

A technology of ventilation device and exposure device, which is applied in the field of integrated circuit manufacturing, can solve problems such as inability to use and wear, and achieve the effect of reducing the formation of atomization defects

Inactive Publication Date: 2009-12-30
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This contact can even render the photomask unusable due to wear and tear before it enters the cleanroom where wafers are made

Method used

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  • Exposure device and method for photomask haze reduction via ventilation
  • Exposure device and method for photomask haze reduction via ventilation
  • Exposure device and method for photomask haze reduction via ventilation

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Embodiment Construction

[0055] It can be appreciated that the following disclosure provides many different embodiments or examples to implement different embodiments of different features. To simplify the disclosure, certain exemplary components and arrangements are described below. However, the specific illustrated components and arrangements described above are illustrative only, and are not intended to limit the scope of the present invention. Furthermore, the present disclosure may repeat a component symbol or component text in different embodiments. Repetition is for simplicity and clarity and is not intended to limit components to the relationship between the various embodiments and / or configurations noted above. Furthermore, in terms of the description that the first feature is formed on the second feature, its embodiment may include that the first feature is in direct contact with the second feature, and may also include that other features are formed between the first feature and the second...

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Abstract

Where a framed pellicle is mounted on a photomask, the framed pellicle comprises a pellicle frame and a pellicle membrane coupled to the pellicle frame, the pellicle frame has first and second apertures each communicating a first space surrounded by the photomask and the framed pellicle with a second space outside of the framed pellicle, exposing a photoresist layer formed on a substrate by flowing gas from within the first space to outside the framed pellicle through the first aperture while simultaneously exposing the photoresist layer to ultraviolet light through the pellicle membrane and the photomask.

Description

technical field [0001] The invention relates to a method and device for manufacturing an integrated circuit, and in particular to an exposure device and method for reducing haze of a photomask by using a ventilation device. Background technique [0002] Photomasks are commonly used in the photolithography process of semiconductor manufacturing. Photomasks are typically made of very flat quartz or glass with a layer of chromium deposited on one side. During the photolithography step, the pattern on the binary mask (BIM) or the phase shift mask (PSM) is used to transfer its image to the wafer. However, contamination on photomasks has become a problem. For example, high-precision photomasks used in photolithography processes with wavelengths equal to or less than 248 nanometers (nm) are particularly susceptible to defects. [0003] One of the types of photomask contamination is fogging contamination. Fogging contamination is the deposit formed during the exposure process to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G03F1/00H01L21/027
CPCG03F1/64
Inventor 游秋山
Owner TAIWAN SEMICON MFG CO LTD