Multifunctional sputtering system and process

Abstract

The present invention discloses one kind of multifunctional sputtering and coating system including one cavity, one turntable inside the cavity, several bearing stages on the turntable, and at least two sputtering targets set in the side opposite to the bearing stages and connected to one rotator each. The present invention also provides the sputtering process comprising the steps of setting the workpieces onto bearing stages and the targets, regulating the directions of sputtering targets, vacuumizing the cavity, introducing inert gas or inert gas mixture, and sputtering to obtain product. The multifunctional sputtering and coating system and the sputtering process of the present invention have the advantages of easy sputtering of multilayer composite film and alloy film.

Description

【Technical field】 [0001] The invention relates to the technical field of sputtering, in particular to a sputtering system and a sputtering method with many functions. 【Background technique】 [0002] Sputtering was first used to deposit thin films, to coat mirror surfaces, or to cover thin fabrics; with the development of electronic technology and vacuum technology, sputtering is now widely used in the manufacture of integrated circuits. [0003] Sputtering can generally be divided into RF sputtering (radio frequency sputtering) and DC sputtering, which are mainly distinguished according to the power source used for sputtering. Among them, the target material of RF sputtering can be non-metallic material (semiconductor material and insulating material); while the target material of DC sputtering can only be metal material generally. [0004] The principle of sputtering is that in a vacuum environment, high-energy particles (usually argon ions) generated by glow discharge or ...

AI Technical Summary

Problems solved by technology

[0006] In the prior art, when sputtering is used to prepare multi-layer composite films, it is generally necessary to sputter one layer according to the composition of each coating and then replace the target accordingly to continue sputtering; however, this process is not only cumbersome and difficult to operate, but also easily affects The quality of each layer in the composite coating

In addition, when the alloy film is prepared by the sputtering method in the prior art, the corresponding alloy material is generally used as the target material, but after the target material is determined, it is difficult to continuously adjust the composition of the alloy film

And the function of sputtering device in the prior art is generally comparatively single, for the workpiece processing that needs different plating layer, need to adopt different sputtering device to carry out

Images