Magnetic field distribution homogenization device for magnetron sputtering process chamber

Abstract

The invention discloses a magnetic field distribution homogenization device used in a magnetron sputtering process chamber. A set of magnets on the connecting rod of the flexible four-bar mechanism reciprocates relative to the frame of the flexible four-bar mechanism with different motion trajectories, and rotates with the link mechanism, thereby forming a non-radiative magnetic field distribution that varies aperiodically or weakly. According to the magnetic field distribution homogenization device of the present invention, the magnetic field distribution can be non-periodic or weak periodic, non-radial distribution, so that the uniformity of the magnetic field distribution can be improved, and the uniformity of the sputtering of the target material and the utilization of the target material can be improved Rate. The invention utilizes the curve characteristics of the connecting rod of the flexible four-bar mechanism and the cam mechanism to realize the uniform distribution of the magnetic field, thereby improving the uniformity of the flow field and the sputtering rate in the process chamber, and improving the controllability of the flow field.

Description

technical field [0001] The invention relates to a magnetic field distribution homogenization device used in a magnetron sputtering process chamber. Background technique [0002] In the manufacturing process of integrated circuit chips, such as integrated circuit CMOS, semiconductor elements, thin film transistors, etc., most of the device structure layers fabricated on the substrate are realized by deposition technology. Deposition refers to the process in which a material is deposited physically or chemically on the surface of a substrate to grow a thin film. The film thickness is on the nanometer scale, which is much smaller than other structure dimensions (eg wafer diameter of 6 inches, 18 inches). In a broad sense, deposition is an additive manufacturing process. The deposition techniques mainly include physical vapor deposition (PVD) and chemical vapor deposition (CVD). PVD uses methods such as evaporation or sputtering to turn solid materials into vapors, condense a...

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Problems solved by technology

However, with these methods, the motion trajectory of the magnetron still presents periodic regularity and radial distribution, and the sputtering in the middle of the target is relatively concentrated, and the sputtering of the target is still uneven.

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