Magnetic field distribution homogenization device for magnetron sputtering process chamber

Abstract

The invention discloses a magnetic field distribution homogenization device for a magnetron sputtering process chamber. And a group of magnets on the connecting rod of a flexible four-rod mechanism doreciprocating motion relative to the rack of the flexible four-rod mechanism according to different motion trails and do rotating motion along with the connecting rod mechanism, so that non-radiativemagnetic field distribution changing in an aperiodic or weak-periodic manner is formed. According to the magnetic field distribution homogenizing device, magnetic field distribution can be distributed in an aperiodic or weakly periodic or non-radial mode, so that the magnetic field distribution uniformity can be improved, and then the target sputtering uniformity and the target utilization rate can be improved. According to the invention, the curve characteristics of the connecting rod of the flexible four-rod mechanism and the cam mechanism are utilized to realize uniform magnetic field distribution, so that the uniformity and sputtering rate of a flow field in the process chamber are improved, and the controllability of the flow field is improved.

Description

technical field [0001] The invention relates to a magnetic field distribution homogenization device used in a magnetron sputtering process chamber. Background technique [0002] In the manufacturing process of integrated circuit chips, such as integrated circuit CMOS, semiconductor elements, thin film transistors, etc., most of the device structure layers fabricated on the substrate are realized by deposition technology. Deposition A process in which a material is physically or chemically deposited on the surface of a substrate to grow a thin film. The thickness of the film is nanoscale, which is far smaller than other structural dimensions (such as wafer diameters of 6 inches and 18 inches). In a broad sense, deposition is an additive manufacturing process. Preparation techniques using deposition methods mainly include physical vapor deposition (physical vapor deposition, PVD) and chemical vapor deposition (chemical vapor deposition, CVD). PVD uses methods such as evapor...

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Problems solved by technology

However, using these methods, the motion trajectory of the magnetron still presents periodic regularity and radial distribution, and the sputtering in the middle of the target is relatively concentrated, and the sputtering of the target is still uneven.

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