Probe measurement device and system

Abstract

A probe measurement device is prepared for setting test elements larger circuit board and improving layout of test elements on circuit board for enabling to set more test elements on circuit board, furthermore enabling to arrange prepared measurement probe on old tester for raising probe measurement performance of old tester.

Description

technical field [0001] The invention relates to a wafer testing device, in particular to a probe measuring card which changes the layout of components to increase the number of configurable components. Background technique [0002] With the continuous evolution of semiconductor technology, the current transistor channel (Channel Length) has evolved from 0.15 microns to 0.13 microns, and further developed to the latest 90-nanometer process. In the semiconductor process, before the wafer process is completed and the packaging is not cut, in order to ensure the yield of the wafer and avoid the waste of the packaging, the electrical and functional tests at the wafer stage must be carried out first. This test method is to use the test machine and the probe card (Probe Card) to form a test circuit, and directly connect the probe head (Probe Pin) on the probe card to the pad (Pad) or bump (Bump) on the chip Contact, and use the probe to detect each chip on the wafer, so as to lead...

AI Technical Summary

Problems solved by technology

[0005] However, due to the current IC requirements of smaller size, stronger functions, and more pins, coupled with the successful development of the power signal sharing (Driver Share) test method, the test machine needs more probes , but the number of probes of the old probe card has not increased. If the traditional probe card is used for chip testing, it will not only be time-consuming and laborious, but also the

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