Multi-chip build up package structure for optronic chip and its manufacturing method

Abstract

This invention relates to a layer-increasing package structure of multiple photoelectric chips including a metal carrier, an IC chip, a photoelectric chip, several dielectric layers and several circuit layers and a transmission conduction base board of a layer-increasing package structure, in which, said IC chip is set on the metal carrier and covered by a dielectric layer, several electrodes of which are connected to the circuit layers, part of said photoelectric chip is embedded in a dielectric layer and exposes a photoelectric action region and several electrodes of the chip, said transmission conduction base board is set above the dielectric layers and the photoelectric chip, and the photoelectric chip and the IC chip embedded in the way of layer-increasing are connected by the circuit layers.

Description

technical field [0001] The invention relates to the packaging technology of optoelectronic chips, in particular to a multi-chip build-up packaging structure of optoelectronic chips and a manufacturing method thereof. Background technique [0002] Optoelectronic chips are used in video electronic products to achieve various functions such as image sensing, image display, lighting, light storage, light output or light input. Due to the large package size of conventional optoelectronic chips, it will occupy the assembly space of video electronic products, and its electrical transmission path is also quite long, which is prone to cross-talk effects. [0003] Please refer to FIG. 1 , a photoelectric chip package structure 100 of a conventional image sensor is a single-chip package type, mainly including a substrate 110 , a photoelectric chip 120 , several bonding wires 130 and a light-transmitting sheet 140 . The substrate 110 has an upper surface 111 and a lower surface 112, wh...

AI Technical Summary

Problems solved by technology

In the optoelectronic chip packaging structure 100 described above, the optoelectronic chip 120 is a digital signal processor chip (not shown) that is electrically conductive to an external circuit board through the bonding wires 130 and the substrate 110. The path is too long to perform image processing quickly and it is easy to cause cross-talk effect (cross-talk effect)

[0004] Taiwan Patent Certificate No. M246808 "Build-Up Structure of Image Sensor" discloses that an image sensor packaging structure includes a circuit build-up structure, and the image sensing chip is housed in a crystal cavity of a carrier board and senses region facing upward, the circuit build-up structure is formed on the carrier board and on the image sensing chip, since the circuit build-up structure is formed on the active surface of the image sensing chip and the carrier board, when increasing It is easy to contaminate the sensing area of ​​the image sensor chip during the layer packaging process, and the circuit build-up structure must have a window, which cannot cover the sensing area, so the conductive circuit configuration in the circuit build-up structure restricted, unable to densify

In addition, the circuit build-up structure needs to reserve the window, which increases the manufacturing cost

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