Unlock instant, AI-driven research and patent intelligence for your innovation.

Modular LED package structure

A technology of LED packaging and modularization, which is applied in the cooling/heating devices of lighting devices, lighting devices, components of lighting devices, etc., which can solve the problems of heat dissipation in LED packaging structures and achieve good heat dissipation effects

Inactive Publication Date: 2007-10-03
FUDAN UNIV
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to design a modular LED packaging structure in order to solve the heat dissipation problem of the traditional LED packaging structure, and can be assembled into LED lamps of various powers suitable for high-power lighting occasions according to lighting needs, and can be conveniently based on The light output angle of the entire lamp needs to be adjusted arbitrarily through optical design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Modular LED package structure
  • Modular LED package structure
  • Modular LED package structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The used elements of the present invention are as follows:

[0017] LED chip: Multiple white LED chips plus phosphor.

[0018] Aluminum substrate: hexagonal, square or triangular.

[0019] Slotted aluminum substrate: coated with reflective film on the surface.

[0020] Large Lens: Optically designed optical glass lens.

[0021] As shown in Figure 1 or Figure 3, nine 1W LED chips are packaged on a hexagonal or square substrate, and the entire module can form a 9W lighting fixture for indoor lighting such as desk lamps;

[0022] As shown in Figure 4 and Figure 5, three 9W modules are assembled into a 27W lighting fixture, which can be used for outdoor lighting.

[0023] Instrument assembly process:

[0024] Assemble according to Figure 1 and Figure 2. The white light LED chip is bound in the groove of the aluminum substrate. The inner surface of the groove is coated with reflective material to form a small lens, so that the angle of the outgoing light is close to para...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention belongs to the field of LED package technology, and relates to a modular LED package structure and its method. The invented modular LED package structure is composed of several portions of hexagonal, quadrant or triangular aluminium baseplate (on the aluminium baseplate surface several grooves are cut, and the surface of every groove is coated), LED chip and large lens, LED chip is packaged in the groove, two side surfaces of said groove are coated with reflecting material, and can be used as reflector, so that the light outpulted from LED is approaching to parallel light. If a high-power LED illuminating lamp apparatus is made, several above-mentioned modules can be combined together so as to form the high-power LED lamp apparatus, on the exterior of said lamp apparatus an optical lens can be added, so that the angle of the outputted light can be reached to application requirements.

Description

technical field [0001] The invention belongs to the technical field of LED chip packaging, and in particular relates to a high-power modular LED packaging structure. technical background [0002] Most of the existing high-power LED chips are packaged on a small (about 5mm) copper substrate, and a one-watt or three-watt chip is packaged to make a lamp holder. When a high-power LED lighting source is needed, multiple one-watt ( 3 watts) the lamp head is fixed on the aluminum plate with screws or heat-conducting glue for heat dissipation. In this way, due to the thermal resistance between the lamp holder and the aluminum substrate, the heat dissipation area of ​​the aluminum substrate is limited, resulting in the LED working heat cannot be exported, so that the temperature of the LED chip rises sharply, and the temperature of the aluminum substrate (that is, the working environment temperature of the chip) greatly exceeds the temperature of the chip. The working temperature is...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/00H01L25/075F21V7/20F21V13/04F21V29/505
Inventor 刘木清周小丽李文宜张万路袁川
Owner FUDAN UNIV
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com