Unlock instant, AI-driven research and patent intelligence for your innovation.

Lead frame encapsulation structure with the high-density pin array

A technology of packaging structure and lead frame, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc.

Inactive Publication Date: 2007-10-17
ADVANCED SEMICON ENG INC
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main purpose of the present invention is to provide a lead frame structure with high-density pin arrangement to solve the insurmountable problems in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lead frame encapsulation structure with the high-density pin array
  • Lead frame encapsulation structure with the high-density pin array
  • Lead frame encapsulation structure with the high-density pin array

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Please refer to FIGS. 4 to 6. FIG. 4 is a top view of a lead frame packaging structure 40 according to a first preferred embodiment of the present invention, and FIG. 5 is a side view of a lead frame packaging structure 40 according to a first preferred embodiment of the present invention. 6 is a top view of the printed circuit board 50 according to the first preferred embodiment of the present invention. As shown in FIG. 4 and FIG. 5 , the lead frame package structure 40 includes a chip package 42, a plurality of J-shaped pins 44 and a plurality of L-shaped pins 46, wherein each pin 44 and 46 includes an inner soldering terminal ( not shown) and an outer welding end 48, wherein there is a distance 48a between each outer welding end 48 in the same column. As shown in FIG. 6 , a printed circuit board 50 is provided, wherein the printed circuit board 50 has a plurality of connecting terminals 52 corresponding to the external soldering terminals, and there is a gap 52 a be...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a lead frame base package structure with a high-density arranged pins. The said lead frame base package structure contains a chip, a plurality of first type pins, and a plurality of second type pins, wherein the first and second type pins located at at least one side of the chip, and electrically connected with the chip. The first and second type pins are any two kinds selected from a J-shaped pin, and a L-shaped pin and a I-shaped pin, and the welding end of the first type pins and the welding end of the second type pins are arranged in a dislocation mode, so that the pins can be arranged in a high-density without occurrence short-circuit.

Description

【Technical field】 [0001] The present invention relates to a lead frame package structure, in particular to a lead frame package structure in which pins can be arranged in a high density through dislocation arrangement of soldering ends of pins. 【Background technique】 [0002] Due to the advantages of low manufacturing cost and high reliability, the lead frame package structure has been used in the field of integrated circuit packaging for a long time, especially for low pin count chips. [0003] Please refer to FIG. 1, FIG. 2 and FIG. 3, FIG. 1 is a top view of an existing lead frame packaging structure 10, FIG. 2 is a side view of an existing lead frame packaging structure 10, and FIG. 3 is an existing printed circuit board 30's top view. As shown in Figures 1 and 2, the existing lead frame packaging structure 10 includes a chip 12, several pins 14 and a die placement area 16, wherein there are several bonding pads 18 on the chip 12 and each pin 14 is respectively It incl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
CPCH01L2224/32245H01L2224/48091H01L2224/73265H01L2224/48247H01L2224/16245H01L2224/49171
Inventor 洪志斌欧英德
Owner ADVANCED SEMICON ENG INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com