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Heat radiator

A technology of heat dissipation device and heat sink, which is applied in the direction of cooling/ventilation/heating transformation, instrument cooling, instrument, etc. It can solve the problems of large size of heat dissipation device and poor heat dissipation effect, so as to improve heat dissipation effect, reduce volume, The effect of increasing the contact area

Inactive Publication Date: 2007-12-12
INNOCOM TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to overcome the problems of large volume and poor heat dissipation effect of heat dissipation devices in the prior art, the present invention provides a heat dissipation device with small volume and good heat dissipation effect

Method used

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  • Heat radiator
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Embodiment Construction

[0016] Please refer to FIG. 2 , which is a three-dimensional schematic view of the heat dissipation device 20 disclosed in the first embodiment of the present invention. The heat dissipation device 20 is disposed on an integrated circuit board 2 . The integrated circuit board 2 is a rectangular printed circuit board on which a plurality of electronic components are arranged.

[0017] The heat dissipation device 20 includes a heat conduction base 21 and a plurality of heat dissipation fins 22 . The heat conducting base 21 is disposed on the integrated circuit board 2 by welding. The plurality of cooling fins 22 are a group of flat plates arranged at intervals in parallel, and the plurality of cooling fins 22 are integrated with the heat conducting base 21, and each cooling fin 22 is arranged vertically to the heat conducting base 21. On each cooling fin 22 There are a plurality of ventilation holes 23 distributed in the array, and the ventilation holes 23 are circular through...

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Abstract

The invention relates to a radiating device. The radiating device includes at least one radiating piece; the radiating piece possesses several airways, the surface of inner wall of the airway is bigger than sum of end surface of two ends of airway. The airway increases the radiating area of the radiating device and enlarges air convection; radiating effect can be increased, at the same time volume of the radiating device can be decreased.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for electronic components. Background technique [0002] With the continuous improvement of the performance of electronic devices, heat sinks or heat dissipation systems have become one of the indispensable accessories in current electronic devices, because if the heat energy generated by electronic devices is not properly released, the performance will deteriorate at least, and the serious It may cause burning of the electronic device. Heat dissipation is even more important for microelectronic components, such as integrated circuits. Because with the increase of integration and the progress of packaging technology, the area of ​​integrated circuits is continuously reduced, and the heat accumulated per unit area is relatively higher, so heat dissipation devices with high heat dissipation efficiency have always been actively pursued by the electronics indust...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/467G12B15/06
Inventor 周和康周通
Owner INNOCOM TECH SHENZHEN
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