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Semiconductor device and method for manufacturing the same

A manufacturing method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve the problem that the size of semiconductor chips is easily damaged, etc.

Active Publication Date: 2007-12-19
SONY CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the larger the size of the semiconductor chip in the exposed state, the easier it is to be damaged.

Method used

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  • Semiconductor device and method for manufacturing the same
  • Semiconductor device and method for manufacturing the same
  • Semiconductor device and method for manufacturing the same

Examples

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Embodiment Construction

[0025] The invention will now be described with reference to preferred embodiments. This preferred embodiment is only an example of the present invention and does not limit the present invention.

[0026] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0027] FIG. 1(A) is a perspective view showing a schematic configuration of a semiconductor device 10 according to the embodiment. FIG. 1(B) is a cross-sectional view showing a cross-sectional structure on line A-A' of FIG. 1(A). The semiconductor device 10 includes: a substrate 20; a semiconductor chip 30 that is flip-chip mounted on the substrate 20 in a flip-chip state; a sealing resin layer 40 that is molded around the semiconductor chip 30; a phase change portion 42 that It is arranged on the back surface of the semiconductor chip 30 and can be thermally connected to heat dissipation components such as radiators and heat pipes. The semiconductor device 10 of the prese...

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PUM

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Abstract

The heat dissipation characteristics of a semiconductor device having a flip-chip mounted semiconductor chip are improved at low costs. The semiconductor device includes: a substrate; the semiconductor chip which is flip-chip mounted on the substrate with the front surface of the chip facing downward; a sealing resin layer which is molded around the semiconductor chip; a phase change portion which is provided on the rear surface of the semiconductor chip so as to be capable of being thermally connected to a heat dissipation member such as a heat sink or a heat pipe. The phase change portion is melted by the operating heat of the semiconductor chip. Therefore, the intimate characteristics between the semiconductor chip and the heat dissipation member are improved, and the heat dissipation characteristics of the semiconductor chip are improved.

Description

technical field [0001] The present invention relates to a semiconductor device and its manufacturing method. More specifically, the present invention relates to a semiconductor device excellent in heat dissipation and a method of manufacturing the same. Background technique [0002] In recent years, with the miniaturization, higher functionality, and higher speed of electronic equipment such as computers, mobile phones, and PDAs (Personal Digital Assistance), ICs (Integrated Circuits), LSIs ( Semiconductor devices such as semiconductor chips such as large-scale integrated circuits) are further miniaturized, high-speed, and high-density. Miniaturization, high speed, and high density of semiconductor devices lead to increased power consumption, which tends to increase the calorific value per unit volume. Therefore, in order to ensure the operational stability of the semiconductor device, a technique for improving the heat dissipation of the semiconductor device is indispensa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L21/50
CPCH01L2224/32225H01L23/50H01L2224/73253H01L21/565H01L23/3121H01L2924/15311H01L2924/19106H01L2924/19041H01L23/4275H01L2224/73204H01L2224/32245H01L2224/16225H01L2924/1815H01L2924/00
Inventor 草野英俊大出知志
Owner SONY CORP