RF integrated circuit with ESD protection and esd protection apparatus thereof

An electrostatic discharge protection, radio frequency integrated circuit technology, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as rising costs, and achieve the effect of saving chip area and reducing manufacturing costs

Inactive Publication Date: 2007-12-26
UNITED MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, since the implementation of the above-mentioned inductors for ESD protection must occupy a very large amount of chip area, the cost will increase significantly

Method used

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  • RF integrated circuit with ESD protection and esd protection apparatus thereof
  • RF integrated circuit with ESD protection and esd protection apparatus thereof
  • RF integrated circuit with ESD protection and esd protection apparatus thereof

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Embodiment Construction

[0033] FIG. 3 is a block diagram of a radio frequency integrated circuit with electrostatic discharge protection according to an embodiment of the present invention. Referring to FIG. 3 , in the radio frequency integrated circuit 300 , the internal circuit 320 transmits and receives radio frequency signals and general signals through the radio frequency bonding pad 310 and the general bonding pad 350 respectively. Power required by the internal circuit 320 is supplied from the outside through a power rail VDD, a power pad 360 , a power rail VSS, and a power pad 370 . In this embodiment, the power rail VDD is a system voltage rail, and the power rail VSS is a ground rail. Under normal operation, the power rails VSS and VDD are used to provide the ground voltage and the system voltage to the internal circuit 120, respectively. Wherein, it should be noted that FIG. 3 is a simplified illustration example, and actually the number of various pads is not limited to that shown in FIG...

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PUM

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Abstract

A radio frequency (RF) integrated circuit with electrostatic discharge (ESD) protection and an ESD protection apparatus thereof are provided. The ESD protection apparatus includes a substrate, an RF bonding pad, and an ESD protection unit. The RF bonding pad for transmitting RF signal is disposed upon the substrate. The ESD protection unit is disposed under the RF bonding pad. Wherein, The ESD protection unit includes an inductor electrically connected between the RF bonding pad and the power rail.

Description

technical field [0001] The present invention relates to an electrostatic discharge (ESD) protection device, and in particular to a radio frequency integrated circuit with electrostatic discharge protection and an electrostatic discharge protection device thereof. Background technique [0002] ESD can be roughly divided into Human-Body Model (HBM), Machine Model (MM) and Charge-Device Model (CDM). Electronic circuits are unavoidable to be impacted by electrostatic discharge in the actual use environment, and some components will be damaged if no proper protection measures are taken. When electrostatic discharge occurs, a large amount of electrostatic discharge current will generate high temperature and damage semiconductor components, so how to prevent electrostatic discharge current from impacting the internal circuit of the integrated circuit is very important. In order to avoid the aforementioned situation, the integrated circuit must have electrostatic discharge protecti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/60H01L27/02H01L23/482
CPCH01L2924/14H01L24/10H01L27/0251H01L2924/3011H01L23/60H01L24/02H01L23/5227H01L2224/0401H01L24/05
Inventor 严国辉吴昌庆林子超
Owner UNITED MICROELECTRONICS CORP
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