Glass substrate carrier for preventing static congregation

Abstract

The invention is a glass substrate carrier preventing static congregation, comprising a basal frame and multiple pads, where the basal frame is earthed, and formed with two erect seats, the two erect seats are conductors and two opposite ¿Ã-shaped brackets horizontally project from each erect seat, these brackets are conductors, at least a bearing part projects from each side of the end of each bracket, these bearing parts are conductors; these pads are arranged on these bearing parts separately, elastic and conductors; thus, the pads, bearing parts, brackets and erect seats compose a static discharge path, able to avoid over static congregation damaging glass substrate circuit on the carrier.

Description

technical field [0001] The invention belongs to a glass substrate carrier, in particular to a glass substrate carrier that prevents static electricity from gathering. Background technique [0002] Thin and frivolous LCD screens have become mainstream commodities nowadays, and are widely used in various occasions. [0003] The core component of the LCD screen is the glass substrate. In the manufacturing process of the LCD panel, thin film transistors and related circuits must be made on the glass substrate. The yellow light manufacturing process is to coat a uniform layer of photoresist on the glass substrate. , and then cooperate with a photomask to form a circuit pattern on the photoresist layer in subsequent steps, so that subsequent steps such as exposure and development can be performed. [0004] The current method of coating photoresist on a glass substrate is to place the glass substrate on a rotary photoresist coating machine, then drop an appropriate amount of photo...

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Problems solved by technology

[0006] When the carrier transports the glass substrate to the deburring machine and the glass substrate is separated from the pad, the static electricity generated on the pad can reach 15-16 kilovolts (Kilovolt, KV), and will damage the semiconductor components and circuits on the glass substrate , in severe cases, it may cause the entire glass substrate to be scrapped, thus greatly reducing the yield of the glass substrate

[0007] In view of the shortcoming that the existing carrier and the glass substrate are easy to generate high-voltage static electricity at the moment of detachment and damage the original semiconductor elements and circuits on the glass substrate, the inventors improved the shortcomings and defects, and then invented a glass substrate carrier that can effectively discharge and accumulate static electricity. Tool

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