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Multilayer printed wiring board

A multi-layer printing and circuit board technology, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve problems such as peeling, poor ductility, and easy cracks in electroless plating, so as to reduce connection reliability and improve integration rate effect

Inactive Publication Date: 2010-07-07
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is generally believed that because the previously formed electroless plating film contains organic substances, hydrogen molecules, hydrogen atoms, etc. and is relatively brittle, cracks are likely to occur on the electroless plating film.
In addition, it is generally believed that since the ductility of the electroless plating film is poor, when a warpage occurs on the printed wiring board when mounting an IC chip or the like, the electroless plating film cannot follow the warpage. Deformed and easy to peel off the land

Method used

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  • Multilayer printed wiring board
  • Multilayer printed wiring board
  • Multilayer printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0031] like Figure 8 As shown, the solder bumps 78U on the upper surface side of the multilayer printed wiring board 10 are connected to the lands 92 of the IC chip 90 . On the other hand, the solder bump 78D on the lower surface side is connected to the land 96 of the sub-board 94 .

[0032] Figure 9 (A) is a plan view of the cap-shaped plating layer (via land) 36a. The opening for the through hole is formed by drilling to a size of 0.08 mm to 0.25 mm. The cap-shaped plating layer 36a is formed in a circular shape. When the radius of the opening 16 of the through-hole is R and the radius of the bottom of the via-hole 60A having a center of gravity 60g is r, the via-hole 60A on the cap-shaped plating layer 36a The bottom of is formed in a circle with a radius R+r / 3 centered on the center of gravity 36g of the through hole. Here, the radius R of the via hole opening 16 is formed to be 50 μm, and the bottom radius r of the via hole 60A is formed to be 22.5 μm. on the othe...

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Abstract

To provide a multilayer printed wiring board which does not deteriorate connection reliability by using a small diameter via hole. [MEANS FOR SOLVING PROBLEMS] Via holes (60A, 60B) are formed on covering plating layers (36a, 36d) and have via hole bottoms formed within a circle having a radius of R(through hole radius)+r(via hole bottom radius) / 3, with a through hole gravity center at the center.A stress applied on the via holes is smaller than that applied on a via hole (160) formed on a second interlayer resin insulating layer (150). Thus, a bottom diameter of the via holes (60A, 60B) is made smaller than that of the via hole (160).

Description

technical field [0001] The present invention relates to a multilayer printed wiring board, in particular to a laminated multilayer printed wiring board which can be suitably used as a package substrate for IC chip mounting. Background technique [0002] In a build-up multilayer printed wiring board that constitutes a package for an IC chip, an interlayer insulating resin is formed on both sides or one side of a core substrate in which a through hole is formed by a drill, and is opened by laser or photolithography for The via hole for interlayer conduction forms an interlayer resin insulating layer. On the inner wall of the via hole, a conductor layer is formed by plating or the like, and patterned by etching or the like to produce a conductor circuit. Furthermore, by repeating the operation of forming interlayer insulating layers and conductor layers, a build-up multilayer printed wiring board was obtained. In the latest build-up multilayer circuit board, in order to incre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H01R12/51
CPCH05K3/4602H05K2201/09627H05K2201/0959H05K2201/0352H05K2201/0347H05K1/115H05K2201/09509H05K2201/096H05K2201/09454H01L2224/16225H01L2924/15311Y10T29/49165H05K3/42H05K3/46
Inventor 吴有红
Owner IBIDEN CO LTD