Barium crown glass powder for electronic slurry and preparation method thereof

A technology of lead-free glass powder and electronic paste, which is applied in the field of lead-free glass powder and its preparation, can solve problems such as the inability to use electronic paste, and achieve the effects of excellent chemical stability, strong competitiveness, and easy thermal expansion coefficient

Inactive Publication Date: 2008-01-30
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sintering temperature of the paste made of the glass powder of this patent is 800-900°C, and the time is 5-15 minutes, which shows that this kind

Method used

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  • Barium crown glass powder for electronic slurry and preparation method thereof
  • Barium crown glass powder for electronic slurry and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] According to the weight percentage of the composition in Table 1, the ingredients are mixed evenly, the glass frit is put into a quartz crucible, and heated and melted in a silicon carbon rod electric furnace at a melting temperature of 1200 ° C and kept for 12 minutes.

[0036] The annealed sample is ground into a cylindrical sample of φ5×25mm for performance analysis: the coefficient of thermal expansion (α) is measured by a WRP-1 microcomputer thermal dilatometer, and the temperature rises from room temperature to 300°C with a heating rate of 5°C / min; The sealing temperature is obtained through the hemispherical experiment; the change of the surface gloss is obtained by spreading the glass powder evenly on the alumina ceramic substrate, and after sintering in the muffle furnace, when the glass powder is in a leveled state, put it in a 100°C In deionized water, the change of surface gloss after 1 hour of heat preservation, the gloss change is the change of gloss observ...

Embodiment 2

[0039] According to the weight percentage of the composition in Table 1, the ingredients were mixed evenly, the glass frit was put into a quartz crucible, and heated and melted in a silicon carbide rod electric furnace at a melting temperature of 1150°C and kept for 10 minutes.

[0040] The annealed sample was ground into a cylindrical sample with a size of φ5×25mm for performance analysis. The test results are shown in Table 1.

[0041] The melted glass is poured into a tablet press to be pressed into tablets, and is ball-milled into powdered glass powder by a ball mill, and then sieved through a 300-mesh sieve, and the sieved glass powder is packaged for use by users.

Embodiment 3

[0043] According to the weight percentage of the composition in Table 1, the ingredients were mixed evenly, the glass frit was put into a quartz crucible, and heated and melted in a silicon carbide rod electric furnace at a melting temperature of 1250°C and kept for 16 minutes.

[0044] The annealed sample was ground into a cylindrical sample with a size of φ5×25mm for performance analysis. The test results are shown in Table 1.

[0045] The melted glass is poured into a tablet press to be pressed into tablets, and is ball-milled into powdered glass powder by a ball mill, and then sieved through a 300-mesh sieve, and the sieved glass powder is packaged for use by users.

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Abstract

The invention relates to lead-free glass powder used in electronic paste and preparation methods thereof. The lead-free powder at least comprises Bi2O3 of 40-70wt %, B2O3 of 10-40wt %, ZnO of 5-40wt %, Al2O3 of 2-10wt %, and SiO2 of 2-10wt % which are mixed and melt into glass powder. The lead-free sealing glass powder not only has moderate thermal expansion coefficient and softening temperature, excellent chemical stability and simple preparation method, but also is applicable for the sealing of VFD, FED, PDF, CRT and the sealing of anything which has consistent temperature and thermal expansion coefficient; therefore, the invention has powerful competition in the lead-free development and performance and promising market development prospect.

Description

technical field [0001] The invention belongs to lead-free glass powder and a preparation method, in particular to a lead-free glass powder for electronic paste and a preparation method. Background technique [0002] Electronic paste is the basic material for the manufacture of thick film components. It is a paste made of solid powder and organic solvents that are mixed uniformly by three-roll rolling. According to different purposes, it is divided into dielectric paste, resistance paste and conductive paste; according to the type of substrate, it is divided into ceramic substrate, polymer substrate, glass substrate and metal insulating substrate electronic paste, etc.; according to different sintering temperatures , can be divided into high temperature, medium and low temperature drying electronic paste; according to different purposes, it can be divided into general electronic paste (making general thick film circuits) and special electronic paste (stainless steel substrate...

Claims

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Application Information

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IPC IPC(8): C03C8/24
Inventor 陈培李胜春
Owner DONGHUA UNIV
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