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Electric slurry leadless low-melting point medium glass and production method thereof

A technology of electronic paste and low melting point, which is applied in the field of electronic paste glass and its preparation, can solve the problems of slow lead poisoning, not easy to be detected, and serious health hazards, and achieves wide performance adjustment range, high cost performance, and easy Effect of thermal expansion coefficient

Inactive Publication Date: 2011-06-08
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing low-melting-point glass for electronic paste contains a large amount of heavy metal lead. Lead is one of the six metals first used by human beings. It is harmful to human health and can accumulate in the body to cause lead poisoning. The role of lead poisoning Rather slow and stealthy, it is not easy to detect until the toxicity is manifested

Method used

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Examples

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Embodiment Construction

[0033] The technical solution of the present invention will be described in detail below through specific examples.

[0034] The invention provides a method that can be widely used in the coating of circuit substrates, the additives of resistance components and electronic pastes, the sealing of various flat glasses, etc., and has the advantages of low melting point, good dielectric properties, non-toxic and non-polluting To meet the market demand for lead-free low melting point electronic glass powder.

[0035] Wherein, the described lead-free low-melting-point dielectric glass comprises the following components by weight ratio:

[0036] Bi 2 o 3 70-85%

[0037] B 2 o 3 9~24%

[0038] ZnO 0.1~10%

[0039] Al 2 o 3 0.1~5%

[0040] SiO 2 0~3%

[0041] Specific embodiments of the lead-free low-melting electronic glass of the present invention are provided below. The following lists 4 kinds of lead-free low-melting point dielectric gl...

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PUM

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Abstract

The present invention discloses an electronic pulp unleaded low melting point dielectric glass and the preparation. The ingredients of the raw materials include by weight percent: 70-85 percent of Bi2O3, 9-24 percent of B2O3, 0.1-10 percent of ZnO, 0.1-5 percent of Al2O3 and 0-3 percent of SiO2. The preparation includes (1) fully mixing the raw materials; (2) putting the materials into a crucible and then into an electric furnace with the temperature between 1100 and1200 DEG C and preserving the temperature for 2-4 hours; (3) casting the glass metal after melt into certain shape; (4) putting the glass metal to a ball grinder for ball-milling; and (5) after ball-milling, carrying out sieving, detecting and packaging on the glass powder. Through the adjustment of the mixture rate relation among all the ingredients, the unleaded low melting point dielectric glass can be obtained, with the sintering temperature being 480-550 DEG C. The glass designed in the invention has good stability and low softening point, is suitably used as the low melting point glass applied in electronic pulp and simultaneously is applicable to the additives of high power valves, electrothermal tubes and thick film resistors as well as insulation coatings of circuit boards and the like, and has good insulating and dielectric performances.

Description

【Technical field】 [0001] The invention belongs to the field of electronic paste glass and its preparation, in particular to an electronic paste lead-free low melting point dielectric glass and a preparation method. 【Background technique】 [0002] The existing low-melting-point glass for electronic paste contains a large amount of heavy metal lead. Lead is one of the six metals used by humans at the earliest. It is harmful to human health and can accumulate in the body to cause lead poisoning. The role of lead poisoning Rather slow and stealthy, it is not easy to detect until the toxicity is manifested. Lead is a cumulative poison, which is easily absorbed by the gastrointestinal tract. Part of it destroys the blood to decompose red blood cells, and part of it spreads to the organs and tissues of the whole body through the blood and enters the bones. However, lead compounds deposited in internal organs and bone marrow are excreted very slowly from the body, gradually forming...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C3/066C03C3/145
Inventor 董福惠夏秀峰赵利云
Owner DONGHUA UNIV
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