All-solid state wireless transmitting equipment and electronic power component dual-cooling source liquid cooling system

A technology of wireless transmission and electronic power, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of system inoperability, damage, and difficulty in adopting, and achieve the effect of stable and reliable working process and guarantee system safety

Inactive Publication Date: 2008-01-30
杭州南广科技有限公司
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Problems solved by technology

The above measures can achieve the cooling effect to a certain extent, but the pure water cooling measures not only have a great corrosion effect on the metal components of the equipment itself, but also the deposition of impurities in the water body in the equipment will also affect the working effect of the equipment; using air cooling Although the air-conditioning cooling avoids the above-mentioned technical defects, since the primary exchange cooling system adopts forced air-cooled exchange, it will bring in environmental impurities and wet and cold water during the working process, which will damage the electronic components. At the same time, due to its own The adjustment temperature is limited above the ambient temperature, which also has great limitations in application. In addition, because it uses a single cold source system, once the air conditioner or wind power equipment fails, the entire system will not work, which is not easy to adopt.

Method used

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  • All-solid state wireless transmitting equipment and electronic power component dual-cooling source liquid cooling system

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Embodiment Construction

[0021] In order to better illustrate the technical description of the present invention, further description will now be made in conjunction with the accompanying drawings.

[0022] As shown in Figure 1, an all-solid-state wireless transmission device and electronic power component dual cooling source liquid cooling system, including heating block cooling system, primary exchange cooling system 7, gas / liquid delivery pump and sealed pipeline 6, heating block cooling The system includes a heating block 1, a heating block 2, and a heating block 3. The input end of the heating block is provided with a flow sensor 13, and the output end thereof is provided with a temperature sensor 5; the primary exchange cooling system 7 includes a fan module 6 and a fan module 7, The fan modules 6 and 7 automatically adjust the speed and air volume according to temperature changes; the air / liquid delivery pump includes a main air / liquid delivery pump 14 and a backup air / liquid delivery pump 15, a...

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Abstract

A full solid state radio transmission equipment and electronic power component dual-cooled source liquid cooling system comprises a heating block cooling system, a first grade exchange cooling system, a gas or liquid transportation pump and a sealing pipeline, the invention is characterized in that the system further comprises a second grade refrigeration system provided with a liquid level switch. The whole system adopts a closed-loop structure and has the advantages of full closing, no noise, no impurity and clean environment. The whole system adopts liquid cooling direct exchange technology, avoids the air condition wind, natural wind and other moisture air or clotted water entering the electronic components, and effectively ensures the safety of the system. At the same time the sealing pipeline of the system is provided with a plurality of parallel connection dual directions rapid interfaces, which can be connected with the external equipment, the unlimited expansion of the system functions can be realized.

Description

technical field [0001] The invention mainly relates to a dual cooling source liquid cooling system, in particular to a dual cooling source liquid cooling system applied to all solid-state wireless transmitting equipment and electronic power components. Background technique [0002] At present, with the rapid development of digital TV transmission technology and integrated circuit technology, high-power equipment with high integration has been widely used in its field. At the same time, these devices consume a lot of power and generate a lot of heat during operation. If corresponding measures are not taken to dissipate heat in time, it will not only affect the normal operation of the entire integrated circuit, but even burn out the entire device in severe cases. In response to this situation, measures such as water cooling, air cooling, or air-conditioning refrigeration are currently used in the industry to dissipate heat from integrated circuit modules and heat dissipation c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 方昭敏潘国平张伟金原子
Owner 杭州南广科技有限公司
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