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Leadless environmental-protection oxidation-resistance welding flux and the preparation technics thereof

An anti-oxidation and environmentally friendly technology, applied in manufacturing tools, welding equipment, welding/cutting media/materials, etc., can solve the problems of poor anti-oxidation performance, poor solder joint smoothness, and poor solderability, and achieve improved anti-oxidation performance. Effect

Inactive Publication Date: 2008-02-06
天津市瑞坚新材料科贸有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The commonly used lead-free solders today are tin-copper and tin-silver-copper alloys, but their oxidation resistance is poor, and a large amount of oxidation slag will appear in the production process, which not only increases the production cost, but also causes poor solder joint finish, which can cause Weldability is poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0007] Example 1: 7g of copper (Cu), 1g of scandium (Sc), 0.3g of phosphorus (P), other impurities containing tin (Sn) and no more than 0.1g. Phosphorus and tin are first thrown into the reaction furnace in a ratio of 100:1, and a tin-phosphorus alloy is made under the condition of 800 ° C and 2.0 MPa, and then the obtained alloy is calculated according to the ratio of phosphorus required in Example 1 and other metals Fusion in the reaction furnace under normal temperature and pressure conditions.

Embodiment 2

[0008] Example 2: 7g of copper (Cu), 0.5g of scandium (Sc), 0.5g of phosphorus (P), other impurities containing tin (Sn) and no more than 0.1g. Same process as above

Embodiment 3

[0009] Example 3: 7g of copper (Cu), 2g of scandium (Sc), 1g of phosphorus (P), other impurities containing tin (Sn) and no more than 0.1g. Same process as above

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PUM

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Abstract

The invention belongs to the welding material field, in particular to the electronic welding field. A lead-free pro-environment oxidation resistance solder is provided, the main ingredient and content (w / w) of which is that copper is ranged from 0.2percent to 2percent, scandium is ranged from 0.05percent to 0.2percent, phosphorus is ranged from 0.03percent to 0.1percent and remained tin. The phosphorus and the tin are made into midbody alloy in condition of from 600 DEG C to 800 DEG C and from 1.5MPa to 2.0MPa. The midbody alloy is fused with other metals in normal atmosphere of 350 DEG C. The invention is used as the lead-free oxidation resistance solder, which has little oxidize dregs in using process, therefore, the oxidize resistance performance of the solder is improved. According to RHOS standard the content of the harmful substance of the invention is far lower than limit content, thereby being beneficial to protect environment.

Description

technical field [0001] The invention belongs to the field of welding materials; in particular, the field of electronic welding. Background technique [0002] Because the tin-lead solder traditionally used in the electronics industry contains harmful substances, pollutes the environment, and damages the health of operators. With the enhancement of people's environmental awareness, the formulation of the European RHOS law makes it gradually replaced by lead-free environmentally friendly solder. The commonly used lead-free solders today are tin-copper and tin-silver-copper alloys, but their oxidation resistance is poor, and a large amount of oxidation slag will appear in the production process, which not only increases the production cost, but also causes poor solder joint finish, which can cause Weldability is poor. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a lead-free, environment-fr...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/03
Inventor 张凤兰宋红石岳涛
Owner 天津市瑞坚新材料科贸有限公司
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