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Method for improving detection of chemical mechanical grinding termination and detection of front channel

A technology of end point detection and front-end process, which is applied in the direction of grinding machine parts, workpiece feed movement control, manufacturing tools, etc., can solve the problem of no alarm, etc., and achieve the effect of reducing the production of abnormal products

Inactive Publication Date: 2008-02-27
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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Problems solved by technology

However, there is no alarm function for early false detection

Method used

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  • Method for improving detection of chemical mechanical grinding termination and detection of front channel
  • Method for improving detection of chemical mechanical grinding termination and detection of front channel

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Embodiment Construction

[0022] As shown in Figure 1, the normal endpoint detection time is about 59 seconds. When the end point detection is abnormal, the abnormal end point detection time is advanced by about 36 seconds (see Figure 2), but because the curve characteristics meet the end point detection conditions, it is mistakenly caught in advance.

[0023] The present invention adopts the method of setting the correct detection time range through the transformation of the end point detection technology of the chemical grinding machine. Once the detection time exceeds the set range, that is, the time is less than the set lower limit or greater than or equal to the set upper limit, The machine alarms and stops grinding for detection and processing.

[0024] As shown in Figure 3, the specific implementation method of the present invention is: in the software setting of grinding program, set the minimum grinding time; Record the grinding time of the main grinding step when the end point is detected; T...

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Abstract

The invention discloses a modifying method of chemically mechanic grinding terminal detection and last procedure detecting method, which comprises the following steps: setting correct time detecting time; making the time less than the lower limit or more than or equal the upper limit if the detected time exceeds the setting scale; alarming and stopping grinding to do detecting disposal. The invention can realize the terminal of real-time detection to find abnormal technique and problem of detecting hardware, which reduces the production of abnormal product, therefore fitting for terminal detecting method of temperature changing elementary and current strength changing elementary.

Description

technical field [0001] The invention relates to a manufacturing process method of a semiconductor integrated circuit, in particular to a method for improving the end point detection of chemical mechanical polishing and the detection front process. Background technique [0002] In semiconductor technology, some processes such as shallow trench isolation (STI) manufacturing process and chemical mechanical polishing (CMP) are commonly used to remove and level over-filled silicon oxide (HDPoxide). [0003] Endpoint detection during chemical mechanical polishing is characterized by process stability. In order to meet the requirements for controlling the loss amount of silicon nitride, the CMP process generally needs to use endpoint detection (EPD) to control the grinding time. [0004] At present, the endpoint detection method is used in shallow trench isolation (STI-CMP) process, tungsten grinding (W-CMP) process and copper grinding (Cu-CMP) process. [0005] For example, in t...

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Application Information

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IPC IPC(8): B24B49/10
Inventor 王海军谢煊程晓华杨欣
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP