Adhesive sheet for laser processing

A technology of laser processing and adhesive sheets, applied in laser welding equipment, metal processing equipment, adhesives, etc., can solve the problem of peeling off one obstacle and other problems, and achieve the effect of reducing processability, preventing melting and preventing deterioration.

Inactive Publication Date: 2008-02-27
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem of bringing obstacles to the subsequent process, that is, the process of stretching the base material film to peel off the workpiece and recovering them one by one.

Method used

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  • Adhesive sheet for laser processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] (acrylic adhesive)

[0068] Copolymerize butyl acrylate / ethyl acrylate / 2-hydrocarbyl ethyl acrylate / acrylic acid in a weight ratio of 60 / 40 / 4 / 1, and obtain 100 parts by weight of an acrylic polymer with a number average molecular weight of 500,000, isocyanic acid 3 parts by weight of salt-based crosslinking agent (manufactured by Nippon Polyurethane Co., Ltd., including Coronet HL), 2 parts by weight of epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., Tetrad C). 500 parts by weight of toluene, uniformly dissolved and mixed to prepare an acrylic adhesive solution. This propylene-based adhesive solution was applied onto a PET separator (PET film with a silicone release agent), and dried at 120° C. for 3 minutes to obtain an adhesive layer A with a thickness of 10 μm.

[0069] (Base material film + melting protective layer)

[0070] Aluminum vapor-deposited polypropylene film VM-CPP2203 with a thickness of 25 μm is laminated on the back ...

Embodiment 2

[0080] As shown in Fig. 1(b), on the back side of the polypropylene / polyethylene composite film B of the base material film 12, the resin film 13 with the metal layer 14, that is, the aluminum vapor-deposited film VM-CPP2203 (East Co., Ltd. (Toray Film Processing Co., Ltd.), an adhesive sheet for laser processing with a fusion protection layer was produced by affixing the fusion protection layer using the adhesive layer A11 (film thickness 5 μm) instead of thermal lamination.

[0081] Using the obtained adhesive sheet for laser processing, the same cutting process as in Example 1 was performed. As a result, no fusion was observed between the adhesive sheet and the clamping table.

Embodiment 3

[0083] (Silica dispersed EVA sheet)

[0084] 100 g of Ebaflex EV450 (ethylene-vinyl acetate copolymer resin, melting point: 84° C., manufactured by DuPont Poly Chemical, Mitsui) was mixed with 400 g of toluene. Then, it was stirred at 50° C. for one hour to obtain a polymer solution. 30 g of silica filler PLV-4 (manufactured by TATSUMORI) with an average particle diameter of 4 μm was added, and stirred for 30 minutes until uniform, to obtain a silica filler dispersion solution. (Reference: The melting point of silica is 1540°C.

[0085] The obtained silica filler dispersion solution was coated on a PET separator (PET film with silicone release agent), and dried at 120° C. for 3 minutes to obtain a silica filler dispersion resin layer having a thickness of 20 μm.

[0086] As shown in 1(c), the silica filler dispersed resin layer 10 is pasted on the base material film 12, that is, the polypropylene / polyethylene composite film B, by thermal lamination at 80° C., and then the ad...

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Abstract

An adhesive sheet for laser processing, comprises a base film and an adhesive layer laminated on the surface of the base film, wherein the base film has a melting protection layer on the back side thereof. According to the adhesive sheet for laser processing of the present invention, the melting of the base film caused by the local concentration of laser beam energy at the places irradiated with the laser beam can be effectively prevented. Accordingly, the back side of the base film can be prevented from locally adhering to the processing table in the dicing apparatus, and subsequent steps, namely, drawing the base film to separate the workpiece from the adhesive layer, and individually recovering these, can be carried out easily and efficiently.

Description

technical field [0001] The present invention relates to an adhesive sheet for laser processing, and more specifically relates to an adhesive sheet for laser processing used when a workpiece such as a semiconductor wafer is cut with a laser. Background technique [0002] Recently, along with miniaturization of electrical and electronic equipment, etc., miniaturization and high precision of parts are progressing. Therefore, high precision and high precision are required even in the cutting process of various materials. In particular, in the field of semiconductors where miniaturization and high density are strongly demanded, attention has been paid to a semiconductor wafer cutting method using a laser with less thermal damage and capable of high-precision processing in recent years. [0003] This technique is, for example, a method in which a workpiece having various circuits formed on a substrate and surface-treated is fixed on a dicing sheet, and the workpiece is cut into c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02B23K26/00H01L21/301B23K26/60B23K26/70C09J7/20C09J7/24C09J7/25C09J7/28C09J7/29C09J7/30C09J7/38
CPCB23K26/18C09J7/0296C09J7/29Y10T428/2848H01L21/48H01L21/78
Inventor 佐佐木贵俊高桥智一浅井文辉山本晃好新谷寿朗
Owner NITTO DENKO CORP
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