Laminated board comprising photopolymer

A photosensitive resin and laminate technology, applied in the field of laminates, can solve the problems of insufficient storage stability, resist pattern formation and conductor pattern formation, and achieve stable conductor pattern formation, high adhesion, high The effect of resolution

Inactive Publication Date: 2008-03-19
ASAHI KASEI E-MATERIALS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned photosensitive resin laminates cannot sufficiently satisfy perform

Method used

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  • Laminated board comprising photopolymer
  • Laminated board comprising photopolymer
  • Laminated board comprising photopolymer

Examples

Experimental program
Comparison scheme
Effect test

Example

[0126] Examples 1 to 6 and Comparative Example 1

[0127]

[0128] The photosensitive resin composition of the composition shown in Table 1 was well stirred and mixed, and it was uniformly applied to a flexible substrate using a bar coater (copper foil thickness 9μm, long side length 10m, industrial speperx NS Nippon Steel Chemical manufacturing) The surface was dried in a dryer at 95°C for 1 minute to form a photosensitive resin layer. The thickness of the photosensitive resin layer is 10 μm.

[0129] Next, a 16 μm-thick polyethylene terephthalate film as a protective layer was pasted on the surface of the photosensitive resin layer on which the flexible substrate was not laminated to obtain a long-belt-shaped laminate with a photosensitive resin.

[0130] The obtained photosensitive resin-coated laminate was wound around a cylindrical core made of ABS with a diameter of 10 cm and a length of 20 cm to obtain a roll-shaped photosensitive resin laminate.

[0131]

[0132] Place...

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Abstract

The present invention provides a laminate with photosensitive resin, and has excellent performances of corrosion-resistance image shaping, conductor pattern shaping, and preservative stability. The present invention relates to a long-strip-shaped laminate with photosensitive resin; conductive sheets are overlapped on one side or two sides of an insulative resin layer to form a long-strip-shaped structure; the present invention consists of a layer which is formed by photosensitive resins and is arranged on at least one side of the conductive sheet, and the thickness of the layer is arranged thicker than 1 micrometer but thinner than 20 micrometer; the present invention is characterized in that the photosensitive resins contains (a) thermoplastic copolymers, carboxyl content of which is more than 100 but less than 600 if counted by acid equivalent, and the molecular weight on weight average of which is more than 20,000 but less than 500,000; (b) photopolymerisable unsaturated compounds; (c) photopolymerization initiator and specific compounds.

Description

technical field [0001] The present invention relates to a laminated board with a photosensitive resin, etc., and particularly relates to a long strip-shaped laminated board with a photosensitive resin useful in the manufacture of a TAB substrate or a flexible circuit board, and a TAB substrate or a laminate using the same. Manufacturing methods of flexible circuit boards and the like. Background technique [0002] At present, when manufacturing printed circuit boards, tape automated bonding (Tape Automated Bonding, hereinafter referred to as TAB) substrates, semiconductor packages, etc., the following steps are generally used: on one or both sides of the insulating resin layer corresponding to various uses On the laminated conductive foil structure, a layer composed of photosensitive resin is laminated, and a resist pattern is formed through exposure and development steps using active light, followed by etching or electroplating to form a conductive pattern, and then peeling...

Claims

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Application Information

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IPC IPC(8): G03F7/09H01L21/48H01L21/60
Inventor 井上直人
Owner ASAHI KASEI E-MATERIALS CORPORATION
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