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Laminated board comprising photopolymer

A photosensitive resin and laminate technology, applied in the field of laminates, can solve the problems of insufficient storage stability, resist pattern formation and conductor pattern formation, and achieve stable conductor pattern formation, high adhesion, high The effect of resolution

Inactive Publication Date: 2008-03-19
ASAHI KASEI E-MATERIALS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned photosensitive resin laminates cannot sufficiently satisfy performances such as storage stability, resist pattern formability, and conductor pattern formability.

Method used

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  • Laminated board comprising photopolymer
  • Laminated board comprising photopolymer
  • Laminated board comprising photopolymer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6 and comparative example 1

[0127]

[0128] Stir and mix the photosensitive resin composition shown in Table 1 well, and apply it to a flexible substrate (copper foil thickness 9 μm, long side length 10 m, industrial spanex Nippon Steel Co., Ltd.) using a bar coater. Chemical production) on the surface, it was dried in a dryer at 95° C. for 1 minute to form a photosensitive resin layer. The thickness of the photosensitive resin layer was 10 μm.

[0129] Next, a polyethylene terephthalate film with a thickness of 16 μm was pasted as a protective layer on the surface of the photosensitive resin layer on which the flexible substrate was not laminated to obtain a long strip-shaped photosensitive resin-attached laminate.

[0130] The obtained laminate with a photosensitive resin was wound up on a cylindrical core with a diameter of 10 cm and a length of 20 cm made of ABS to obtain a roll-shaped photosensitive resin laminate.

[0131]

[0132] Place the mask required in the evaluation of the photosensitiv...

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Abstract

The present invention provides a laminate with photosensitive resin, and has excellent performances of corrosion-resistance image shaping, conductor pattern shaping, and preservative stability. The present invention relates to a long-strip-shaped laminate with photosensitive resin; conductive sheets are overlapped on one side or two sides of an insulative resin layer to form a long-strip-shaped structure; the present invention consists of a layer which is formed by photosensitive resins and is arranged on at least one side of the conductive sheet, and the thickness of the layer is arranged thicker than 1 micrometer but thinner than 20 micrometer; the present invention is characterized in that the photosensitive resins contains (a) thermoplastic copolymers, carboxyl content of which is more than 100 but less than 600 if counted by acid equivalent, and the molecular weight on weight average of which is more than 20,000 but less than 500,000; (b) photopolymerisable unsaturated compounds; (c) photopolymerization initiator and specific compounds.

Description

technical field [0001] The present invention relates to a laminated board with a photosensitive resin, etc., and particularly relates to a long strip-shaped laminated board with a photosensitive resin useful in the manufacture of a TAB substrate or a flexible circuit board, and a TAB substrate or a laminate using the same. Manufacturing methods of flexible circuit boards and the like. Background technique [0002] At present, when manufacturing printed circuit boards, tape automated bonding (Tape Automated Bonding, hereinafter referred to as TAB) substrates, semiconductor packages, etc., the following steps are generally used: on one or both sides of the insulating resin layer corresponding to various uses On the laminated conductive foil structure, a layer composed of photosensitive resin is laminated, and a resist pattern is formed through exposure and development steps using active light, followed by etching or electroplating to form a conductive pattern, and then peeling...

Claims

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Application Information

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IPC IPC(8): G03F7/09H01L21/48H01L21/60
Inventor 井上直人
Owner ASAHI KASEI E-MATERIALS CORPORATION
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