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A pumped intro-cavity for semiconductor side pumped intro-module

A side pumping, semiconductor technology, applied in the field of pumping cavity, can solve the problems of low yield, poor heat dissipation, LDA scrap, etc., achieve the effect of large solid-state laser output, reduce assembly difficulty, and improve reliability

Inactive Publication Date: 2010-05-12
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of LDA has complex structure, poor heat dissipation, low yield and short life
If one core section in the array is damaged, it will cause the entire LDA to be scrapped

Method used

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  • A pumped intro-cavity for semiconductor side pumped intro-module
  • A pumped intro-cavity for semiconductor side pumped intro-module
  • A pumped intro-cavity for semiconductor side pumped intro-module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] Such as Figure 1a The shown pump chamber for a semiconductor side pump module includes: a heat sink body 1 , a movable body 3 , and a single core segment 4 .

[0022] The heat sink body 1 is made of metal with high thermal conductivity and easy processing, such as Figure 1a , figure 2 , image 3 As shown, the heat sink body 1 includes a heat sink block 7 and an internally processed cooling channel 2. The heat sink block 7 is located between the two ends 8 of the heat sink body 1, and the outer end surfaces of the two ends 8 have regular equilateral contours. Polygon, with a round hole in the center of the polygon, reserved for placing the laser crystal and as a cooling channel for the laser crystal, the inner wall of the hole can be formed by ultra-fine processing, sputtering, evaporation or electroplating. is the pump chamber 9. The heat sink blocks 7 are evenly distributed on the heat sink body 1 centered on the hole or the pump chamber 9 , and the heat sink bloc...

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PUM

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Abstract

The invention discloses a pumping cavity for a pumping module at the lateral side of a semiconductor. The pumping cavity comprises a heat sink body, movable elements, and single core knots. The heat sink body comprises heat sink blocks and a central hole, wherein the heat sink blocks are uniformly arranged around the center of the heat sink body, a plurality of movable elements are movably arranged on the heat sink blocks, the singe core knots are arranged on the movable elements, and a laser crystal can be arranged in the central hole of the heat sink body. The invention adopts the pumping cavity with the single core knot and a high-power laser diode, and has the advantages of compact structure, long service life, convenient maintenance, and modularization.

Description

【Technical field】 [0001] The invention relates to a pumping chamber using a single-chip high-power laser diode as a pumping source, in particular to a pumping chamber suitable for semiconductor side pumping modules. 【technical background】 [0002] At present, semiconductor high-power laser diode array (Laser Diode Array, hereinafter referred to as LDA) is often used as the pump source for side pump modules. Most of the LDA structures integrate multiple bars on a heat sink, and the bars are connected in series. , where each bar is integrated by multiple single core sections. This LDA has complex structure, poor heat dissipation, low yield and short life. If one die in the array is damaged, the entire LDA will be scrapped. Single-chip high-power laser diode (Single Emitter, hereinafter referred to as single-core tube) has the advantages of simple structure and long service life (currently, the service life of single-core tube is generally more than 200,000 hours, while the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S3/0941H01S5/024H01S5/40
CPCH01S3/025H01S3/061H01S3/0941H01S3/042
Inventor 高云峰肖岗蒲罡陈建飞杨延青
Owner HANS LASER TECH IND GRP CO LTD