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Lithographic apparatus, method of calibrating a lithographic apparatus and device manufacturing method

A technology of lithography equipment and components, which is applied in the field of manufacturing devices and can solve problems such as errors and coverage errors

Active Publication Date: 2011-05-11
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Disturbance of the mirror can cause errors in the substrate position determination process, which can lead to overlay errors

Method used

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  • Lithographic apparatus, method of calibrating a lithographic apparatus and device manufacturing method
  • Lithographic apparatus, method of calibrating a lithographic apparatus and device manufacturing method
  • Lithographic apparatus, method of calibrating a lithographic apparatus and device manufacturing method

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Embodiment Construction

[0032] figure 1 A lithographic apparatus according to an embodiment of the present invention is schematically shown. The apparatus comprises an illumination system (illuminator) IL configured to condition a radiation beam B (e.g., UV radiation or DUV radiation); a support structure (e.g., a mask table) MT configured to support a patterning device (e.g., a mask ) MA, and is connected with the first positioner PM, and the first positioner PM is configured to accurately position the patterning device according to specific parameters; the substrate table (eg, wafer table) WT is configured to support the substrate ( For example, a resist-coated wafer) W, connected to a second positioner PW configured to precisely position the substrate according to specific parameters; and a projection system (e.g., a refractive projection lens A system) PS configured for projecting a pattern imparted to a radiation beam B onto a target portion C of a substrate W by a patterning device MA (eg comp...

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PUM

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Abstract

A lithographic apparatus includes a system to compensate for the effect of thermal distortion of the substrate table on position measurements of the substrate table using lateral mirrors in the substrate table. Methods of calibrating a lithographic apparatus using various substrate table scan trajectories and measurements of the localized position and rotation of lateral mirrors in the substrate table are presented. A dual stage lithographic apparatus with alignment marks defining the geometry of a lateral mirror used only at the exposure station to measure the geometry of the lateral mirror when the substrate table is at the measurement station.

Description

technical field [0001] The invention relates to a lithographic apparatus, a method for calibrating a lithographic apparatus and a method of manufacturing a device. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually to a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this example, a patterning device (alternatively referred to as a mask / reticle, or, where applicable, a programmable mirror array) can be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred to a target portion (eg, a portion including one or more dies) on a substrate (eg, a silicon wafer). Typically, the transfer of the pattern is via imaging onto a layer of radiation sensitive material (resist) provided on the substrate. Typically, a single substrate will contain a network of successively p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/027
CPCG03F7/70516G03F7/70775G03F7/70858G03F7/70341G03F7/706847G03F7/706851
Inventor 科恩·雅各布斯·约翰尼斯·玛利亚·扎尔约斯特·耶罗恩·奥藤斯尤多库斯·玛丽·多米尼克斯·斯图尔德拉伊尔安东尼厄斯·约翰尼斯·德科尔特弗朗西斯库斯·范德马斯特马尔特伊恩·德容
Owner ASML NETHERLANDS BV