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A graphic plating method for dual-side and multi-layer flexible printed circuit board

A technology of flexible printing and pattern electroplating, which is applied in the fields of printed circuit, multilayer circuit manufacturing, printed circuit manufacturing, etc., can solve the problem that the inner wall surface of the via hole cannot be plated with copper layer to form hole copper, and achieve the goal of improving the product yield rate Effect

Active Publication Date: 2008-03-26
华德环科暖通工程(泰州)有限公司
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to make up for the defect that the surface of the inner wall of the via hole cannot be plated with copper to form hole copper in the above-mentioned prior patent, and propose an improved pattern electroplating method for double-sided and multi-layer flexible printed circuit boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0014] A pattern electroplating method for double-sided flexible printed circuit boards, which has the following steps in sequence:

[0015] Copper foil cutting: Cut the whole roll of copper foil material into a single double-sided copper foil of fixed size;

[0016] Mechanical drilling: CNC drilling is performed on the cut single double-sided copper foil;

[0017] Drilling blackening treatment: For the drilled hole, the hole wall is positively charged with a hole modifier, so that the inner wall of the hole is attached with negatively charged particles of carbon powder, and then the carbon powder on the copper surface is peeled off by micro-etching, leaving only the hole There is a layer of carbon powder on the insulating position of the inner wall to prepare for the formation of hole copper after copper plating;

[0018] Thin copper electroplating of the whole board: put the whole copper clad board into the electroplating solution, deposit a thin copper layer on its surface...

specific Embodiment approach 2

[0032] A pattern electroplating method for a five-layer flexible printed circuit board, the steps of which are the same as the first embodiment.

[0033] The line width and line spacing of the outermost layer of the five-layer flexible printed circuit board are both 0.1mm. After removing the photosensitive film and before chemical cleaning, slice the hole and observe whether the inner wall of the hole is coated with copper to confirm the reliability of copper plating; use AOI to check the circuit pattern, record the yield rate and compare it with the existing conventional production method . The results of the comparison are listed in Table 2 below. The proportion of copper-free semi-finished products on the inner wall of the hole is 0, and the good product rate reaches 94%, which is obviously better than the conventional production method.

[0034] Table 2

[0035] project

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Abstract

The invention discloses a method of electroplating double-face and multilayer flexible printed circuit board diagrams, which is characterized that: after the process step of drilling black oxide treatment, arranging a whole board electroplating covering thin copper step which includes immersing the via hole internal wall surface, a hole disk and a diagram part of the circuit to be arranged of whole copper clad board, depositing a thin copper layer on the surface thereof, the current density of electroplating is 1.6A / dm<2>-2.6A / dm<2>, the electroplating time is in 0.5 hours. Comparing with the prior art, the invention has the beneficial effects that: the method electroplates thin copper on the whole board after the process step of drilling black oxide treatment, the via hole internal wall surface which is adhesived with carbon powder is covered by the copper layer to form hole copper, which prevents alkaline developer contacting with carbon powder, inferior products with open circuit disadvantage can not be generated, the product qualified rate is improved markedly.

Description

technical field [0001] The invention relates to surface treatment of printed circuit boards, in particular to a pattern electroplating method for double-sided and multilayer flexible printed circuit boards. Background technique [0002] Double-sided, multi-layer flexible printed circuit board (Flexible Printed Circuit board, referred to as FPC) is suitable for more complex circuits. They are respectively formed by two layers, at least three layers of conductive pattern layers and insulating material layers alternately laminated and bonded, requiring specified interlayer conductive pattern interconnection. Copper is plated so that it becomes a via that connects the various wires connected to the different layers of the via. The pattern electroplating method is a commonly used typical process for existing double-sided or multi-layer flexible printed circuit boards. The applicant's prior patent 200610061925.2 (application date: July 31, 2006) proposed a method for double-side...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/18H05K3/00
Inventor 肖芳容
Owner 华德环科暖通工程(泰州)有限公司
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