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Heat sink device

A heat dissipation device and heat sink technology, applied in sustainable manufacturing/processing, final product manufacturing, printed circuits, etc., can solve problems such as insufficient thermal conductivity, inability to obtain sufficient heat dissipation performance, and increased material cost to achieve low material cost , heat dissipation performance improvement, thermal stress relaxation effect

Inactive Publication Date: 2008-04-02
RESONAC HOLDINGS CORPORATION
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the heat sink described in Patent Document 1, it is necessary to use a heat sink made of a material with high thermal conductivity and a material with low thermal expansion, so there is a problem that the cost of materials increases.
Furthermore, the radiator and the radiator are only screwed together, so the thermal conductivity between the two is not sufficient, and sufficient heat dissipation performance cannot be obtained.

Method used

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Embodiment Construction

[0057] Embodiments of the present invention will be described below with reference to the drawings. In addition, in the following description, the top and bottom of FIG. 1 are referred to as top and bottom. In addition, in all drawings, the same part and the same component are attached|subjected to the same code|symbol, and repeated description is abbreviate|omitted.

[0058] FIG. 1 shows a part of a power supply module using a heat sink according to a first embodiment of the present invention, and FIG. 2 shows a stress relaxation member.

[0059] In FIG. 1 , the power supply assembly includes: a heat sink (1), and a semiconductor element (2) such as an IGBT mounted on the heat sink (1).

[0060] The heat dissipation device (1) includes: a ceramic insulating substrate (3) whose upper surface is used as a heating element mounting surface, a stress relieving member (4) bonded to the lower surface of the insulating substrate (3), and a stress relieving member (4) bonded to the s...

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Abstract

A heat sink device (1) is provided with an insulating substrate (3) whose one plane is permitted to be a heat generating body mounting plane, and a heat sink (5) fixed on the other plane of the insulating substrate (3). A metal layer (7) is formed on the plane of the insulating substrate (3), opposite to the heat generating body mounting plane. A stress relaxing member (4), which is composed of an aluminum plate (10) provided with a plurality of through holes (9) and has the through holes (9) as stress absorbing spaces, is arranged between the metal layer (7) of the insulating substrate (3) and the heat sink (5). The stress relaxing member (4) is soldered to the metal layer (7) of the insulating substrate (3) and the heat sink (5). The heat sink device (1) reduces material cost and improves heat sink performance.

Description

technical field [0001] The present invention relates to a heat sink, and more specifically, to an insulating substrate having one surface as a heat generating body mounting surface and a heat sink fixed to the other surface of the insulating substrate, and a device for dissipating heat from a semiconductor element mounted on the insulating substrate. The heat emitted by the body is dissipated from the radiator. [0002] In this specification and claims, the so-called "aluminum" includes not only pure aluminum but also aluminum alloys, except for the case where it is expressed as "pure aluminum". Background technique [0003] In power modules using semiconductor elements such as IGBTs (Insulated Gate Bipolar Transistors), it is necessary to efficiently dissipate the heat emitted from the semiconductor elements and keep the temperature of the semiconductor elements below a specified temperature. Therefore, in the past, the use of Al 2 o 3 , AlN and other ceramics, and one s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36
CPCH05K3/0061H01L23/367H05K3/341H05K1/0306H05K2201/09681H05K2201/0969H05K3/4015H01L23/3677H01L23/473H01L23/3735H05K2201/0373H01L2924/0002Y02P70/50H01L2924/00H01L23/36H01L23/40
Inventor 大年浩太河野荣次久保秀人金原雅彦古川裕一山内忍星野良一若林信弘中川信太郎
Owner RESONAC HOLDINGS CORPORATION
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