Filling coated material for lamination of flexible circuit board and laminating technique of flexible circuit board

A technology of flexible circuit board and lamination process, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of increasing lamination cost, etc., achieve cost reduction, omission of process and cost, and good mold release Effect

Inactive Publication Date: 2010-06-09
周伟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, in order to prevent the film from sticking to the steel plate, sometimes two pieces of kraft paper over 160g have to be used as the deformation maintaining material, or a layer of high temperature resistant release film is added between the isolation steel plate and the deformation maintaining material. Both methods increase the lamination cost

Method used

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  • Filling coated material for lamination of flexible circuit board and laminating technique of flexible circuit board
  • Filling coated material for lamination of flexible circuit board and laminating technique of flexible circuit board
  • Filling coated material for lamination of flexible circuit board and laminating technique of flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Formula (recorded in percent by weight):

[0027] Fluidity modifier: calcium carbonate (0.7 microns in particle size) 6%;

[0028] Release agent: white oil 0.3%;

[0029] Dispersant and other processing aids 1%

[0030] The rest are polyethylene resin pellets (polyethylene resin produced by Sinopec with the brand name of 2426H).

[0031] According to the above formula, put all the raw materials in the mixer and mix them evenly to form a mixture, and then use the blow molding machine to blow mold the mixture to obtain a white film with a thickness of 0.06 mm or 0.08 mm, which is the filling bag. Laying material.

Embodiment 2

[0033] Formula (recorded in percent by weight):

[0034] Fluidity modifier: calcium carbonate (0.7 microns in particle size) 5%;

[0035] Release agent: white oil 0.2%;

[0036] Foaming agent: AC foaming agent 3%

[0037] Dispersant and other processing aids 1%

[0038] The rest are polyethylene resin pellets (polyethylene resin produced by Sinopec with the brand name of 2426H).

[0039] According to the above formula, all the raw materials are placed in the mixer and mixed evenly to form a mixture, and then the mixture is blow-molded with a blow molding machine while foaming to obtain a white film with a thickness of 0.06 mm or 0.08 mm. The degree of foaming is 5%, which is the filling and covering material.

[0040] The following are lamination examples of flexible circuit boards implemented according to the present invention:

Embodiment 3

[0042] Lay the isolation steel plate 1, the deformation maintaining material 3, the filling coating material 4, the high temperature resistant mold release film 2, the circuit board protective film 5, the single-sided flexible circuit board insulator 8, and the high temperature resistant mold release film 2 in sequence for 10 Each unit was pressed together with a press for 2 hours under the conditions of 180°C, negative pressure, and a board surface pressure of 18 kg / cm2 to obtain the single-sided flexible circuit board 6 .

[0043] The high temperature resistant release film 2 is made of polyperfluoroethylene propylene film with a thickness of 0.04 mm.

[0044] The filling and wrapping material 4 is selected from the filling and wrapping material 4 with a thickness of 0.6 mm according to Embodiment 1.

[0045] The deformation maintaining material 3 is kraft paper with a weight of 180 grams.

[0046] The isolated steel plate 1 is made of high hardness and low thermal expansio...

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Abstract

The invention relates to filling dressing material for lamination of a flexible circuit board with basic component of polyethylene resin. The film also contains a fluidity modifier, a parting agent and a sponging agent. The flowing and penetrability of the material in molten state are inhibited, with good peeling property of liquid melt and isolate steel plate and low cost. The flexible circuit board using the filling dressing material has the advantages of low laminating process cost, convenient steel plate cleaning operation and stable performance of manufactured flexible circuit.

Description

technical field [0001] The invention relates to a filling and cladding material for lamination of a flexible circuit board and a lamination process of the flexible circuit board. Background technique [0002] The lamination process of single-sided flexible circuit boards commonly used in the prior art is: separating steel plates, deformation-maintaining materials such as kraft paper, filling and covering materials such as polyethylene films, high-temperature resistant release films, circuit board protective films, tapes, etc. Insulators with conductive lines, high temperature resistant mold release films, and isolation steel plates are laid layer by layer to form units as shown in the figure, and one or more units are laid repeatedly. The protective film is tightly wrapped on the flexible circuit board with conductor lines, and with the help of the semi-cured glue on the reverse side of the protective film, the protective film is glued to the circuit and the substrate to for...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00C08L23/06C08K5/00C08J5/18C08J9/00
Inventor 周伟
Owner 周伟
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