Minitype inertial electrical switch capable of regulating and controlling contact time

Abstract

The invention relates to a minitype inertia electrical switch which can adjust the contact time, belonging to the micro electromechanical system technical field. The invention is characterized in that: a mass block electrode with a cantilever beam array comprises a mass block and a cantilever beam array fixed to the mass block; the cantilever beam array is positioned below a fixed electrode of a porous elastic beam; a support layer is positioned above an insulated base and below the mass block; the support unit of a spring and the support unit of the porous elastic beam fixed to the insulated base are positioned around the mass block; a joint snake shaped spring connected with the mass block is hung in the air by the support unit of the spring; the fixed electrode of the porous elastic beam positioned above the mass block is hung in the air by the support unit of the porous elastic beam, and a gap is positioned between the fixed electrode of the porous elastic beam and the cantilever beam array. The invention has the advantages of improving the contact effect of the movable mass electrode and the fixed electrode of the elastic beam, adjusting the contact time of the two electrodes of the minitype inertia switch conveniently, and improving the coordination of the movement of the mass block with the joint snake shaped spring caused by the outside acceleration.

Description

technical field

[0001] The invention relates to a micro-switch in the technical field of micro-electromechanical engineering, in particular to a micro-inertial electrical switch with adjustable contact time. Background technique

[0002] Inertial switches designed and manufactured based on MEMS technology have attracted much attention due to their advantages of small size, low cost and mass production. In the past, the miniature inertia switch, whether it is vertical drive or horizontal drive, has its processing method developed on the traditional integrated circuit manufacturing technology. In many cases, the preparation of the switch is based on the silicon substrate. The inevitable internal stress in the process determines that the height of the entire device cannot be too thick. In order to have a large enough mass to sense the acceleration of the outside world, the overall area of ​​the device will eventually be large. This problem is driven by the horizontal. It is mo...

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