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Device and method for purifying a process gas in a reflow soldering system

A technology for gas treatment and reflow soldering, which is applied in chemical instruments and methods, auxiliary devices, separation devices, etc., can solve the problems of polluting the welding system, making it difficult to ensure that the purified fluid absorbs waste, and achieve the effect of avoiding pollution

Inactive Publication Date: 2008-05-07
雷姆设备制造有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, possible contamination of the welding system
Additionally, it is difficult to ensure that the purge fluid actually absorbs the waste

Method used

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  • Device and method for purifying a process gas in a reflow soldering system
  • Device and method for purifying a process gas in a reflow soldering system
  • Device and method for purifying a process gas in a reflow soldering system

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Experimental program
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Embodiment Construction

[0043] An embodiment of the present invention will now be described with reference to FIG. 1 .

[0044] FIG. 1 shows a schematic cross-sectional view of an apparatus 100 for purifying process gas of a reflow soldering system according to an embodiment of the present invention;

[0045] The apparatus 100 includes a gas scrubbing column 102 . The gas feeding device 115 of the gas washing column 102 is connected with the reflow soldering system 101 . The gas feeding means 115 is formed in the form of a pipe which enters into the container 106 in a substantially vertical direction and passes through approximately the middle of the container. Process gases for the welding system 100 may flow into the container 106 through the gas delivery device 115 . During operation of the apparatus 100, the container 106 is closed by a cover 116, which can be removed when performing maintenance operations on the gas scrubbing column 102. This facilitates access to the interior of the containe...

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PUM

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Abstract

Disclosed is a device for purifying a process gas in a reflow soldering system. Said device comprises a receptacle that contains at least one packing bed. The process gas is fed to the receptacle via a gas inlet while being discharged from the receptacle after penetrating the packing bed. The inventive device further comprises an apparatus for delivering a liquid fluid to the receptacle. Secondary materials of the soldering process in the reflow soldering system can be absorbed by the liquid fluid and thus be eliminated from the process gas. Secondary materials and / or droplets and vapors of the fluid can additionally be absorbed and adsorbed on the surface of the packing.

Description

technical field [0001] The present invention relates generally to reflow soldering, and in particular to the purification of process gases in reflow soldering systems. Background technique [0002] Reflow soldering is often used to secure electronic components to circuit boards. In reflow soldering, solder is first applied to the pads of the circuit board. Then, the components are mounted on the circuit board and heat is used to melt the solder. When the solder resolidifies, the component is permanently bonded to the board. [0003] When heated, products of solder sublimation and evaporation (hereafter referred to as waste) are produced which initially exist in the gaseous state or in the form of small droplets or fumes and enter the process gas volume of the soldering system. If the waste is not removed from the welding system, the waste can condense or resublimate on system parts at low temperatures, or deposit in the welding system. This leads to contamination of the ...

Claims

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Application Information

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IPC IPC(8): B01D47/02B01D47/14B23K3/08
CPCB01D2247/107B23K3/08B01D47/14B01D47/021B01D47/02
Inventor 汉斯·贝尔于尔根·费尔格纳拉尔夫·海登赖克
Owner 雷姆设备制造有限责任公司
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