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Laminating device and laminating method

A bonding device and supporting device technology, applied in chemical instruments and methods, lamination devices, recording/reproducing with optical methods, etc., can solve problems such as troublesome pressure management, complicated device structure, deformed resin, etc., to prevent premature Effects of attaching phenomena, ensuring reproducibility, and preventing deformation

Inactive Publication Date: 2008-05-07
LINTEC CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the case of the laminating device described in Patent Document 1, at least the region where the optical disc substrate and the stamper are bonded must be made into a structure that can be kept in a reduced-pressure environment or a vacuum environment, so there is not only pressure management Troublesome, and the device structure is also very complicated
In addition, the part that becomes a space after bonding in a vacuum environment will deform or cause resin wrinkles in an atmospheric environment, so even in a vacuum environment, it is necessary to bond in such a way that that part of the space cannot be created.
Therefore, it cannot be said that the vacuum bonding method is the best bonding method.

Method used

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  • Laminating device and laminating method
  • Laminating device and laminating method

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Embodiment Construction

[0044] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0045] Fig. 1 is a schematic configuration diagram showing a bonding device according to an embodiment. In this figure, the lamination device 10 is composed of: a first supporting device 12 supporting the optical disc substrate 11 as a first plate-shaped member; a second supporting device 14 supporting a stamper 13 as a second plate-shaped member; A pressing member 15 that applies a pressing force for bonding while the above-mentioned disc substrate 11 and stamper 13 are superimposed; abuts against the outer peripheral portion of the stamper 13 and maintains the unbonded portion with respect to the disc substrate 11 in relief To prevent the state of attaching the component 17 first.

[0046]The above-mentioned first supporting device 12 is composed of: a disc-shaped main base 21 supported by a rotating drive shaft 20 located at the center and arranged to be rotatable in a p...

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Abstract

The present invention discloses a laminating device, which comprises a first supporting device (12) supporting a disk base plate (11), a second supporting device (14) supporting a stamper (13), a pressing member (15) imparting a pressing force to the disk base plate (11) and the stamper (13), and a non-laminated part contact prevention member (17) brought into contact with the outer peripheral portion of the stamper (13) and maintaining the non-laminated part of the stamper in a raised state. By pressing the stamper (13) maintained in that attitude by the pressing member (15), the stamper can be laminated on the disk base plate.

Description

Technical field [0001] The present invention relates to a bonding device and a bonding method, in particular to a type suitable for forming optical recording media such as optical discs (CD), digital versatile discs (DVD), laser discs (LD), Blu-ray discs (BD), etc. On the substrate, a bonding device and a bonding method for bonding a stamper for forming a fine uneven structure for information recording. Background technique [0002] In optical recording media such as optical disks, for example, the following structure is generally adopted: a resin layer is provided on the surface of an optical disk substrate made of polycarbonate, etc., and a fine concavo-convex structure such as pits and grooves is formed on the resin layer, and on the resin layer Layer the reflective film and the protective film in order. [0003] When forming the above-mentioned concavo-convex structure, the following method is generally adopted: a resin layer is first provided on one side of the disc substrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11B7/26
CPCB29C37/0075B32B37/12B29C2059/023G11B7/263B32B38/1858B29L2017/005B32B37/003B29C37/006B29C59/02B29C33/444B29C33/46B32B2429/02B31B19/00B29D17/005
Inventor 早坂拓哉
Owner LINTEC CORP
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