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Photosensitive composition

A technology of photosensitive composition and photopolymerization initiator, which is applied in the direction of optics, photomechanical equipment, and photosensitive materials used in photomechanical equipment, etc., and can solve the problems of low sensitivity of photosensitive composition and inability to form pattern latent images

Active Publication Date: 2011-11-02
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the sensitivity of the photosensitive composition is low, high-speed direct drawing cannot be performed, that is, a pattern latent image cannot be sufficiently formed by short-time ultraviolet light irradiation.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~5、 comparative example 1~2

[0100] The components shown in Table 1 were blended and stirred in the amounts (parts by mass) shown in Table 1, and dispersed by a 3-roll mill to obtain photosensitive compositions, respectively.

[0101] Table 1

[0102]

[0103] Various properties of the solder resist films formed using the compositions of Examples 1 to 5 and Comparative Examples 1 to 2 were examined and evaluated by the following tests.

[0104]

[0105] Each photosensitive composition was coated on a glass plate with a spreader, and then dried at 80° C. for 30 minutes using a hot air circulation drying oven to prepare the dried coating film on a glass plate. About the dry coating film of each photosensitive composition on this glass plate, use ultraviolet-visible spectrophotometer (manufactured by JASCO Corporation, Ubest-V-570DS) and integrating sphere device (manufactured by JASCO Corporation, ISN-470 ) to measure the absorbance. Moreover, the absorbance base line in the wavelength range of 300 n...

Embodiment 6

[0124]Example 1 shown in Table 1 was diluted with methyl ethyl ketone, coated on the carrier film, heated and dried in a hot air dryer at 80° C. for 30 minutes, to form a photocurable thermosetting resin composition layer with a thickness of 25 μm, on which A dry film was obtained by attaching a cover film. Thereafter, the upper film was peeled off, and after the patterned copper foil substrate was thermally laminated and bonded, the exposure was carried out under the conditions of Example 1 shown in Table 3. The aqueous solution was developed for 60 seconds to obtain an image. Further, it was heated and cured in a hot air dryer at 150° C. for 60 minutes to prepare a test substrate. With respect to the obtained test substrate having a cured film, evaluation tests for various characteristics were performed by the above-mentioned test method and evaluation method. The results were the same as those of Example 1 in Table 3.

[0125] As described in detail above, according to t...

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Abstract

The invention provides photosensitive composition. The invention is characterized in that a potential pattern image is formed by the lights from a lamp generating ultraviolet radiations through a direct drawing method; and then the potential pattern image is developed through alkali aqueous solution, wherein, before exposure, a dry coating film displays 0.6 to 1.2 of absorbency within the wave length range of 355nm to 375nm per 25um thickness, while display 0.3 to 0.6 of absorbency at the wave length range of 405nm. Besides, the invention relates to a dry film which is obtained by coating thecomposition on a carrier film and then drying the carrier film.

Description

technical field [0001] The present invention relates to a photosensitive composition which forms a latent pattern image by direct drawing method using light from a lamp generating ultraviolet rays, develops the latent pattern image by an alkaline aqueous solution, and a dry film which is formed by This composition is obtained by applying it on a carrier film and drying it. Background technique [0002] The outermost layer of the printed circuit board is provided with a permanent protective film called solder mask. In order to form this solder resist film, the photoresist method which can accurately form a fine pattern is widely used. Among them, the alkali-developing type photoresist method has become the mainstream from environmental considerations and the like. [0003] As one of the photoresist methods, there is known a one-shot exposure method using light from a lamp that generates ultraviolet rays (Japanese Patent Laid-Open No. 01-141904). In this one-shot exposure m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/16H05K3/00
CPCG03F7/0045G03F7/028
Inventor 柴崎阳子加藤贤治有马圣夫
Owner TAIYO HLDG CO LTD