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Radio-frequency coil capable of preventing short circuit

A technology of radio frequency coil and protective wall, applied in the direction of coil, circuit, sputtering coating, etc., can solve the problem of easy short circuit of radio frequency coil, and achieve the effect of not easy to short circuit

Inactive Publication Date: 2008-06-04
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The purpose of the present invention is to solve the problem of easy short circuit in the working process of the above radio frequency coil, and provide a radio frequency coil structure with high process tolerance, so that it does not produce ground short circuit in the process

Method used

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  • Radio-frequency coil capable of preventing short circuit
  • Radio-frequency coil capable of preventing short circuit
  • Radio-frequency coil capable of preventing short circuit

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Embodiment Construction

[0050] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0051] According to the radio frequency coil of the present invention, such as Figure 5 As shown, it includes: a main body 1 and a connecting part 2 . The connecting part 2 further includes: a central groove 21, an annular groove 22, a central groove wall 23, and an outer wall 24 of the annular groove, wherein the central groove 21 is cylindrical in shape with a depth of 7.874-8.382 mm, and is provided with ribs to cooperate with the bolts. The annular groove 22 is annular with a depth of 7.366-7.874mm. The outer wall 24 of the annular groove is cylindrical and has a height of 5.366-5.874mm. That is, the height of the outer wall 24 of the annular groove is 2mm shorter than that of the central groove 21. Therefore, the process tolerance is 2.686mm.

[0052] The radio frequency coil is used in equipment for forming barrier layers and metal seed layer...

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Abstract

The invention discloses a radiofrequency coil for preventing short circuit which is used for equipment with physical vapor deposition barrier layer metal. The radiofrequency coil comprises a radiofrequency coil body and a protuberance on the radiofrequency coil body; the protuberance also comprises a central groove, central groove wall, a ring groove and ring groove outer wall; the protuberance of the radiofrequency coil is connected with an external power supply through a metal bar, is fixed on a protection wall through a bolt, and is insulated with a metal cup and the protection wall through insulation parts, wherein, the length of the ring groove outer wall is shorter than that of the central groove wall, so the spacing between the bottom of the metal cup and the top of the ring groove outer wall of the protuberance of the radiofrequency coil is enlarged, which avoids the short circuit between the bottom of the metal cup and the top of the shell of the radiofrequency coil during the operation of the equipment, thereby improving the allowedness of the process.

Description

technical field [0001] The present invention relates to semiconductor process equipment, in particular to a radio frequency coil capable of preventing short circuit used in physical vapor deposition (physical vapor deposition, PVD) equipment (Barrier & Seed Tool) for forming a barrier layer and a metal seed layer. Background technique [0002] The process of depositing metal tantalum (Encore Ta) is currently mainly realized by the Endura machine from Applied Materials in the 200mm wafer manufacturing technology. The machine itself consists of a variety of high-vacuum functional reaction chambers, including barrier layer sputtering chambers and seed layer sputtering chambers. The barrier layer can provide a certain support for the wafer, but the most important thing is that it can provide a layer for copper metal. The surface of the crystal nucleus is formed, which makes the subsequent growth of copper easy. In addition, it can prevent the active metal of copper from diffusin...

Claims

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Application Information

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IPC IPC(8): C23C14/35H01L21/203H01F5/00
Inventor 黎东明陈勇志曾玉帆边逸军
Owner SEMICON MFG INT (SHANGHAI) CORP
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