Rectifier grain, production method thereof and suction cup mould

A technology of rectifiers and crystal grains, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of easy exposure of corners of square crystal grains, strong tip discharge, and poor impact resistance of products, achieving The effect of increasing the reliability of tension and solder joints, less damage to grains, and enhanced reverse withstand voltage performance

CN101819992AInactive Publication Date: 2010-09-01GOOD ELECTRONICS WUHU
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2010-09-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a rectifier grain, a production method thereof and a suction cup mould. The grain is in the shape of a regular hexagon. The production method for the grain comprises the following steps of: coating a photo-resist; adhering an MASK film; exposing; making a GPP film; arranging a glass sheet; waxing a chip; arranging a baffle; adhering the baffle; accurately aligning; cutting by sand blasting; and separating the grain. The suction cup mould comprises an upper die and a lower die, wherein the upper and lower dies are detachably connected with each other so as to form a cavity which can be vacuumized; the upper surface of the upper die is provided with a notch; the bottom surface of the notch is provided with a plurality of regularly hexagonal counter bores which are cellular and arranged closely; and each counter bore is communicated with the cavity. By using the structure and the method, the rectifier grain, the production method and the suction cup mould have the advantages that: firstly, the area utilization of the grain is improved, the product is durable, and the impact resistance is enhanced; secondly, the point discharge effect is reduced and the backward voltage resistance of the product is enhanced; and thirdly, the edge of a glass trench of the grain which is cut by the sand blasting method is tidy and the electrical performance is better protected.
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Description

technical field

[0001] The invention relates to a rectifier grain, and also relates to a production method of the rectifier grain and a suction cup mold for realizing the method. Background technique

[0002] At present, the grain shape usually adopted by the rectifier is square. The production process of the square crystal grain (GPP grain) with glass passivation coating and connection is as follows: first, both sides of the diffused round silicon chip are coated with photoresist, and two transparent films (MASK films) are prepared. One of the films has a graphic line printed on it, which is a plurality of squares closely arranged. The other film has crosshairs printed on it. Overlap and match the two MASK films, and stick them firmly along one edge of the MASK films. Place the round silicon chip between two MASK films, exposure and fixation at the same time. The first groove is to open shallow grooves on both sides of the silicon chip, and the side of the chip with the...

Examples

Embodiment Construction

[0029] Such as figure 1 A method for producing rectifier crystal grains is shown, which includes firstly applying photoresist on the diffused silicon chip. The process is as follows: on the vacuum rotary machine, the terminal sucks the chip, drops a few drops of photoresist and rotates until uniform, and bakes. Dry; repeat the reverse side once, so that there is photoresist on both sides, and dry. Prepare two identical MASK films with graphic lines printed on them. The pattern formed by the graphic lines is a plurality of regular hexagons closely arranged in a honeycomb shape. Under the microscope, paste the MASK film on both sides of the silicon chip respectively, and align the patterns of the MASK film on both sides, expose and fix the silicon chip placed in the middle of the two MASK films at the same time, and then follow the fixed pattern on both sides of the silicon chip. Groove the pattern line, first open a shallow groove on the back of the silicon chip, apply photore...