Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Epoxy resin shape memory polymer material and method for producing the same

A polymer material and epoxy resin technology, applied in the field of shape memory materials, can solve problems such as difficulty in realizing saturated shape memory effect, difficult adjustment of thermal response temperature, slow shape recovery rate, etc., to achieve convenient preparation, fast shape recovery rate, The effect of short thermal response time

Inactive Publication Date: 2010-09-01
GUANGZHOU INST OF GEOCHEMISTRY - CHINESE ACAD OF SCI
View PDF2 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing shape memory functional polymer materials have the following disadvantages and deficiencies: (1) The thermal response temperature is not easy to adjust; (2) The thermal response time is long, and the shape recovery rate is slow; (3) It is difficult to realize the saturated shape memory effect

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin shape memory polymer material and method for producing the same
  • Epoxy resin shape memory polymer material and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Take liquid crystal epoxy resin monomer EP-1 and curing agent 4,4'-diaminodiphenylmethane according to the stoichiometric ratio, dissolve and mix with dichloromethane, pre-cure at 120°C for 5 hours under vacuum, then medium temperature at 160°C Curing for 5 hours and post-curing at 200° C. for 1 hour to obtain an epoxy resin shape memory polymer material. The thermal response temperature of the obtained epoxy resin shape memory polymer material was measured to be 153°C.

Embodiment 2

[0022] Take liquid crystal epoxy resin monomer EP-2 and curing agent methyl hexahydrophthalic anhydride according to stoichiometric ratio, dissolve and mix with dichloromethane, add curing accelerator benzyldimethylamine of 1% of the total mass of monomer and curing agent , pre-cured at 115°C for 6 hours in vacuum, then cured at medium temperature at 160°C for 5 hours, and post-cured at 200°C for 1 hour to obtain an epoxy resin shape memory polymer material. Its thermal response temperature is 134°C.

Embodiment 3

[0024] Take liquid crystal epoxy resin monomer EP-14 and curing agent methyl hexahydrophthalic anhydride according to stoichiometric ratio, dissolve and mix with dichloromethane, add curing accelerator DMP-30 of 1% of the total mass of monomer and curing agent, vacuum Pre-cure at 50°C for 12 hours, then cure at medium temperature at 160°C for 5 hours, and post-cure at 200°C for 1 hour to obtain an epoxy resin shape memory polymer material. Its thermal response temperature is 54°C.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a new epoxy resin shape memory macromolecule material and a relative preparation method, wherein the material contains liquid crystal epoxy resin monomer and curing agent at stoichiometry, which may further contains curing accelerator of 0-2% consumption of the total accounts of the liquid crystal epoxy monomer and curing agent. Compared with prior shape memory material, the inventive material has the advantages that (1), the thermal responsible temperature can be adjusted by adjusting the side chain and substituted chain of the liquid crystal epoxy monomer or by selecting curing agent, (2), the heat response time is short and the shape recover is rapid, (3), the product can realize saturated shape memory effect, (4) the product has simple preparation and clear structure.

Description

technical field [0001] The invention belongs to the technical field of shape memory materials, in particular to an epoxy resin type shape memory polymer material and a preparation method thereof. Background technique [0002] Shape memory refers to the phenomenon that a product with an initial shape can be restored to its original shape after being deformed and fixed by external stimulus means such as heating. [0003] Since the 1960s, shape memory materials have attracted worldwide attention due to their unique properties, and related research has also developed rapidly. Shape memory materials include shape memory alloys (SMA), shape memory ceramics (SMC) and shape memory polymers (SMP). Compared with SMA, SMP not only has large deformation, easy shaping, and easy adjustment of shape response temperature, but also has the characteristics of heat preservation, good insulation performance, no rust, easy coloring, printable, light weight and low price. But its disadvantages ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K5/3445
Inventor 梁利岩吕满庚
Owner GUANGZHOU INST OF GEOCHEMISTRY - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com