Large moving range macro-micro dual drive locating platform

Abstract

The invention relates to a wide motion range macro-micro dual-drive positioning platform. A lower platform substrate of the invention is provided with two parallel guide rails; an upper platform substrate is arranged on the two parallel guide rails of a lower platform through linear motion guide assembly; the upper platform substrate is processed into a micro displacement worktable supported by flexible hinges through linear cutting; a stator of a linear motion actuator is fixed on the lower platform substrate; a connecting frame of a rotor of the linear motion actuator is fixed with the upper platform substrate; a grating ruler is arranged on one side of the lower platform substrate and fixed on the lower platform substrate through a fixed mount; a reading head of the grating ruler matched with the grating ruler is fixed with the micro displacement worktable through the connecting frame. A coarse motion worktable of the invention completes wide range high speed movement and the positioning accuracy is in micrometer grade; the micro displacement worktable compensates for positioning error and swing error of the coarse motion worktable so that the positioning accuracy reaches nanometer accuracy.

Description

technical field [0001] The invention relates to a high-speed ultra-precise positioning device with a large motion range, in particular to a macro-micro dual-drive positioning platform with a large motion range. Background technique [0002] The high-speed and high-precision ultra-precision workbench system occupies an extremely important position in the field of modern cutting-edge industrial production and scientific research. With the rapid development of integrated circuit (IC) manufacturing, micro-mechanical electronic systems (MEMS), precision test systems, and precision machining, there is an urgent need for devices capable of large motion ranges, high precision, and high-speed positioning. Judging from the development status of wafer size and processing line width used in IC processing in the world, the line width of VLSI has entered the range of 0.1 μm, and the processed wafer size has reached 300 mm. Now ICs with a characteristic scale of 90nm will reach mass produ...

AI Technical Summary

Problems solved by technology

However, the current problem is that although the traditional workbench system using rotating motors and ball screw drives can achieve a wide range of motion strokes, its positioning accuracy can only reach micron or sub-micron levels

In the positioning device of the rotating motor and the ball screw, the ball screw is a thin and long non-rigid transmission element with low torsional rigidity, and when the moving speed increases, the moment of inertia of the ball screw increases and the mechanical friction and wear are serious , making the transmission error increase

This kind of mechanism is difficult to achieve high-speed movement; although the micro-displacement motion platform driven by piezoelectric ceramics and supported by flexible hinges can reach the nanometer level, its stroke is small, generally only reaching tens of microns to hundreds of microns; Although the motion platform system driven by electric inchworm can achieve large stroke and high-resolution motion performance, its motion speed is too low

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