Display and manufacturing method thereof

Abstract

The present invention relates to a display device, comprising a basal plate, an electrode array, an amorphous row integrated drive circuit and an amorphous column integrated drive circuit, wherein, the basal plate has a surface; the electrode array is arranged on the surface of the basal plate; the amorphous row integrated drive circuit is arranged on the surface of the basal plate and is electrically connected with the electrode array; the amorphous column integrated drive circuit is arranged on the surface of the basal plate and is electrically connected with the electrode array. In addition, the present invention also discloses a manufacturing method of the display device.

Description

technical field [0001] The invention relates to a display device and a manufacturing method thereof, in particular to a display device with an amorphous integrated drive circuit and a manufacturing method thereof. Background technique [0002] With the advent of the information age, due to the increasing demand for people to communicate with the outside world, display devices capable of disseminating information have become one of the indispensable electronic products for modern people. The display device has developed from the original Cathode Ray Tube (CRT) display device to the thinner and thinner Liquid Crystal Display (LCD), and is widely used in communication, information and consumer electronics products. [0003] In general, please refer to FIG. 1 , a conventional display device 1 includes a glass substrate 11 , a pixel array 12 and a plurality of driving circuit chips 13 . The pixel array 12 is disposed on the glass substrate 11 by thin film process technology, and...

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Problems solved by technology

[0004] However, since the pixel array 12 is disposed on the glass substrate 11 by thin film process technology, and the driving circuit chip 13 is manufactured by packaging technology and then combined with the glass substrate 11 by chip on glass (COG) process technology, lead to complexity in the manufacturing process

Among them, the driving circuit chip 13 is further divided into a scanning line driving circuit chip and a data line driving circuit chip, and according to the complexity of the circuits, different process technologies are required to manufacture them respectively, which also increases the process complexity of the display device 1.

[0005] In addition, the design of the size of the substrate 11, in addition to providing space for the pixel array 12 and the driver circuit chip 13, also needs to plan a plurality of reserved spaces 111 to provide the driver circuit chip 13 used in the chip-on-glass manufacturing process (such as thermal Head clearance), resulting in the size of the glass substrate 11 can not be effectively reduced

[0006] Furthermore, please refer to shown in Fig. 2, generally speaking, because the thickness D of driving circuit wafer 13 1 is determined by the chip package design, and the thickness D 1 It is not easy to reduce, so the overall thickness D of the display device 1 0 cannot effectively reduce

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