Photosensitive resin composition and method for manufacturing roasts obtained thereby
A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of fine pattern formation limitation, pattern resolution reduction, etc., and achieve the effect of excellent storage stability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment
[0052] Examples and comparative examples are shown below, and the present invention will be specifically described. However, the present invention is not limited to the following examples. In addition, "parts" and "%" refer to mass standards unless otherwise specified.
[0053] [Paste for electrode wiring of PDP display panel]
Synthetic example
[0055] Add diethylene glycol monoethyl ether acetate as a solvent and azobisisobutyronitrile as a catalyst to a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, and heat to 80°C under a nitrogen atmosphere , dropwise add methacrylic acid to 0.4 mol of methacrylic acid, methyl methacrylate to 0.6 mol molar ratio to mix methacrylic acid and methyl methacrylate monomers in 2 hours, after stirring for 1 hour, raise the temperature to 115°C and deactivate it to obtain a resin solution.
[0056] Next, after cooling the resin solution, 0.4 mol of butyl glycidyl ether was added to an equivalent amount of carboxyl groups of the obtained resin using tetrabutylammonium bromide as a catalyst under the conditions of 95° C. to 105° C. for 30 hours. react and cool.
[0057] In addition, 0.26 mol of tetrahydrophthalic anhydride was subjected to an addition reaction to the OH groups of the obtained resin at 95 to 105° C. for 8 hours, and taken out after...
PUM
| Property | Measurement | Unit |
|---|---|---|
| The average particle size | aaaaa | aaaaa |
| The average particle size | aaaaa | aaaaa |
| Glass transition point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More