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Open type multilayer composite LED heat radiation system

A heat dissipation system, an open technology, used in lighting and heating equipment, cooling/heating devices for lighting devices, electrical components, etc., can solve the problem of heat dissipation - hindering high-power LED lighting, etc. Effective, multi-stage and sufficient effect of heat dissipation

Inactive Publication Date: 2008-07-02
DALIAN & INDAL TRADE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims to most effectively solve heat dissipation - the bottleneck problem that hinders the application of high-power LEDs in lighting

Method used

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  • Open type multilayer composite LED heat radiation system
  • Open type multilayer composite LED heat radiation system
  • Open type multilayer composite LED heat radiation system

Examples

Experimental program
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Effect test

Embodiment Construction

[0022] As shown in Figures 1-7, an open multi-layer compound LED heat dissipation system has a simple and clear structure. Subsequent cooling fins 4, a plurality of special-shaped high-efficiency heat conduction tubes 5, and a main conduction cooling fin 6 are composed. As the main body of the heat dissipation system, the heat dissipation carrier 1 is made of a metal plate with light weight and relatively good heat conduction effect. The present invention designs it as an open multi-layer compound structure, which itself has both basic heat absorption, basic heat dissipation, heat conduction and main body The role of support. A plurality of high-efficiency heat pipes 5 with sufficient length, the heat receiving end 51 and the heat dissipation end 52 are tightly embedded in the heat dissipation carrier 1 or the heat receiving end 51 and the heat dissipation end 52 of the heat pipe are directly embedded in the heat sink 4 In this process, the heat receiving end 51 is made to be...

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Abstract

The invention discloses an open multi-layer composite LED cooling system, which comprises an open two-layer or multi-layer composite cooling carrier made of metal plates with light weight and excellent heat-transfer effect, relatively-large main fins disposed in the upper layer of the cooling carrier, and heat-transfer tubes with high heat-transfer effect and connected between layers. The heated parts and the heat-radiating parts of the heat-transfer tubes are embedded inside the cooling carrier, as close as possible to a heat source and the main fins, with being tightly fixed by the fins at the inner side of the cooling carrier. A light source, as the heat source, is directly fixed in the outside lower part of the cooling carrier. Therefore, the invention realizes a good circulation of uniform heating, rapid and efficient heat transfer and multi-stage and complete heat dissipation; ensures the light-emitting sources such as large-power LED to work under a relatively-low temperature condition with long service life.

Description

technical field [0001] The invention relates to a cooling system, in particular to a lamp with a high-power LED as a light source. Background technique [0002] The development of modern industrial civilization, while bringing people a wealth of material and spiritual enjoyment, at the same time, the negative problems brought about by the excessive development and utilization of limited energy are becoming increasingly diverse and serious. The contradiction between the fast-growing material and cultural needs and the energy shortage has become a major worldwide issue facing us all. The development and application of energy-saving technologies has attracted more and more attention worldwide. [0003] In terms of lighting, it has become a general trend to apply semiconductors to lighting sources, and light-emitting diodes are the top priority in exploring semiconductor lighting sources. [0004] Its development advantage lies in that it can overcome many problems such as shor...

Claims

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Application Information

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IPC IPC(8): F21V29/00F21V3/00F21V17/06H01L23/367F21Y101/02F21V29/51F21V29/76F21Y115/10
CPCH01L2924/0002
Inventor 金光阁李晓晨李秀珪
Owner DALIAN & INDAL TRADE
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