EL device and its making method

Abstract

The invention discloses an electroluminescence device, which comprises a base plate, a reflecting layer, a nano-pattern transparent conductive layer, at least a luminescent diode element, a first contact electrode and a second contact electrode. Among which, the reflecting layer is arranged on the base plate; the nano-pattern transparent conductive layer is arranged on the reflecting layer; the luminescent diode element is arranged on the nano-pattern transparent conductive layer; the luminescent diode comprises a first semiconductor layer, a luminescent layer and a second semiconductor layerone by one; the second semiconductor layer is arranged on the nano-pattern transparent conductive layer and the reflecting layer; the first contact electrode is electrically connected with the first semiconductor layer; the second contact electrode is electrically connected with the second semiconductor layer.

Description

technical field [0001] The invention relates to an electroluminescent device and its manufacturing method, in particular to an electroluminescent device with high efficiency and its manufacturing method. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a kind of luminescent light-emitting element, which utilizes the energy released by the combination of electrons and holes in a semiconductor material, and releases it in the form of light. Depending on the material used, it can emit monochromatic light of different wavelengths, and can be mainly divided into two types: visible light-emitting diodes and invisible light (infrared) light-emitting diodes. Compared with traditional light bulbs, light-emitting diodes are energy-saving. , shock resistance and fast flashing speed, etc., so it has become an indispensable important component in daily life. [0003] Please refer to figure 1 As shown, a conventional light emitting diode device 1 inclu...

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Problems solved by technology

[0004] In the prior art, the epitaxial substrate is generally used as the transparent substrate 11, and the transparent adhesive layer 12 is composed of an organic adhesive material. Since the thermal conductivity of the epitaxial substrate and the organic adhesive material is low, it cannot provide a better heat dissipation path for the LED element 10, resulting in The light-emitting diode device 1 has problems such as the accumulation of heat energy and is difficult to dissipate, which affects the luminous efficiency of the light-emitting diode device 1

[0005] Due to the low luminous efficiency still exists in the development of light-emitting diodes at the present stage, the industry is more focused on how to effectively extract the photons generated in the light-emitting diode element 10, and at the same time reduce the photons generated by the continuous reflection in the light-emitting diode element 10. Necessary thermal energy; on the other hand, it is also committed to solving the problem of dissipating heat energy inside the LED element 10, so as to reduce the overall operating temperature of the LED device 1, and to achieve the ultimate goal of improving the luminous efficiency of the LED device 1

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