Pore-forming template derivative and method of manufacturing dielectrics by using the same

Abstract

Reactive cyclodextrin derivatives or reactive glucose derivatives are used as template derivatives for forming ultra-low dielectric layers. A layer is formed from a reactive cyclodextrin derivative or a reactive glucose derivative containing Si—H at its end, and then the layer is cured in a hydrogen peroxide atmosphere to form an ultra-low dielectric layer.

Description

[0001] Cross References to Related Applications [0002] This application claims the priority of Korean Patent Application No. 10-2006-0135737 filed on Dec. 27, 2006 and No. 10-2007-0042106 filed on Apr. 30, 2007, which are incorporated by reference in their entirety Introduce this article. technical field [0003] The present invention relates to a template derivative for forming an ultra-low dielectric layer and a method for forming an ultra-low dielectric layer using the same, and more particularly, the present invention relates to a method capable of forming a A template derivative for forming an ultra-low dielectric layer and a method for forming an ultra-low dielectric layer using the same. Background technique [0004] Due to the high integration and high speed requirements of semiconductor devices, the line width of metal wirings and the spacing between metal wirings have decreased rapidly over time. In particular, as the pitch between the metal wirings decreases, ...

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Problems solved by technology

[0015] However, since reactive porogens, such as cyclodextrin, have very low reactivity with the matrix compared to the reactivity of the matrix itself, when the content of the porogen is higher than a certain amount, the generation of reactive porogens Agglutination, therefore does not resolve pore morphology

In particular, when the porogen content is high, the pore size and pore connectivity increase, making it impossible to obtain the desired ultra-low dielectric layer

[0016] Moreover, even in ultra-low dielectric layers formed using reactive porogens such as cyclodextrin, when the dielectric constant decreases uniformly and continuously, the pore size increases rapidly, resulting in a rapid decrease in mechanical strength.

In particular, a curing process using UV light should be followed to solve this problem, which makes the process more complicated

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