LED lamp string and manufacturing method thereof

Abstract

The invention discloses an LED lamp string and the making method of the lamp string, and the LED lamp string comprises a lead, a luminous wafer and a coating body. The lead is divided into multiple sections of connecting lines which connect in serials, and the luminous wafer is connected among each section of the connecting line. One end of the connecting lines is provided with an installation platform, and the luminous wafer is arranged at the installation platform and is electrically connected with the installation platform. The other pole of the luminous wafer is connected with adjacent connecting lines through a down-lead, and the luminous wafer, the down-lead and the ends of two connecting lines are sealed in the coating body. When the invention is made, the guide line of the lamp string is divided into multiple connecting lines which are connected in serials, and two adjacent connecting lines are both connected to two poles of the luminous wafer; the LED lamp string is formed after glue injection and encapsulation. Adopting the making method can save the cost of specially producing LED and simplify tedious technology of using the existing LED to manufacture the LED lamp string, which causes the LED lamp string to have the advantages of simpler structure, more convenient and quicker manufacture, lower cost, higher efficiency, better lamp string intensity and better waterproof performance.

Description

technical field [0001] The invention relates to a lamp string product, in particular to an LED lamp string in which light-emitting chips are directly installed and packaged on wires; the invention also relates to a manufacturing method of the LED lamp string. Background technique [0002] In recent years, the development and application speed of light-emitting diodes (LEDs) has been very rapid, such as the emergence and mass production of high-power LEDs, the packaging and production of small-volume LEDs, and so on. But the essence of its light emission is realized by utilizing the electrical characteristics of the semiconductor PN junction, that is, the light emitting chip. The light-emitting diode (LED) includes a chip, metal pins connected to the two poles of the chip, and a housing packaged and wrapped around the light-emitting chip. The production method is as follows: first place a large metal sheet on the mold for punching, remove most of the material, leave the LED ...

AI Technical Summary

Problems solved by technology

[0003] For the production of lighting products such as LED light strings, the existing manufacturing method is to install and connect the manufactured LEDs one by one to the wire to form an LED light string. Such a structured light string is not easy to produce and its efficiency is low. , the cost is also high; moreover, it is difficult to guarantee the connection strength between the LED pins and the light string wires in the finished light string, and there are quality problems in terms of connection firmness and waterproof performance, etc., and some special treatment is required , such as making the mounting seat of the LED, filling the mounting seat with glue, adding spacers between the pins, adding silicone sleeves to the LED, etc. to make it meet the requirements

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