Grid making method

Abstract

The invention provides a manufacturing method for a grid electrode, including the following steps: a substrate is provided, at least one grid electrode material layer is formed on the substrate; a pattern mask layer is formed on the grid electrode material layer; the transverse size of the pattern mask layer is microcopied by the wet-type etching process; the pattern mask layer is taken as the mask to remove a part of the grid electrode material layer, thereby forming a grid electrode with a preset size.

Description

technical field [0001] The invention relates to a method for manufacturing a semiconductor structure, and in particular to a method for manufacturing a gate. Background technique [0002] With the vigorous development of integrated circuits and the strengthening of the functions of electronic products, the application circuits are becoming more and more complex. In order to effectively increase the operating speed of the entire circuit, the density of transistors required in the integrated circuit is also greatly increased. That is to say, the size of each element will continue to shrink, so that the number of transistors in a unit area can be increased. However, the size of components cannot be reduced indefinitely, and there are difficulties to be overcome in terms of design criteria, physical characteristics of components, and even process feasibility. [0003] Taking a metal oxide semiconductor transistor as an example, in the process of defining and shrinking the gate...

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Problems solved by technology

[0006] Another purpose of providing embodiments according to the present invention is to provide a gate manufacturing method, which can improve the problem of incomplete etching and improve the control of the gate profile in the process

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