Electrochemistry-laser mask focusing micro etch method for processing and device thereof

Abstract

The invention relates to an electrochemical-laser mask focusing micro-etching processing method and a device thereof, and belongs to the field of fine processing of manufacture technology. The method is characterized in that the material removal is a result of combination of laser shock and electrochemical reaction. The method is suitable for fine processing of conductive metal materials. The processing method and device comprise: a laser beam sent by a laser passing a mask plate with a hollow out pattern after the homogenizing modulation and beam expanding treatment of a light beam modulator, then micro-shrinking the pattern on the mask plate by using an imaging focus lamp, and imaging on a workpiece surface permeating conductive glass above the workpiece. Passivating electrolyte is arranged between the conductive glass and the workpiece. A positive pole of an electrochemical processing power supply is connected to the workpiece, and a negative pole of the power supply is connected to the conductive glass. In the processing process, the laser beam forms plasma between the electrolyte and the workpiece and rapidly expands, so that a passivation layer, irradiated by the laser, at a processing position of the workpiece surface deforms and is removed. The workpiece material is dissolved, etched and removed at a processing area where the passivation layer is damaged, thus the etching processing with the fine structure is realized. The method and the device can effectively improve the processing efficiency of complex patterns, the degree of fineness of the processing and the processing accuracy.

Description

technical field [0001] The invention relates to the field of micromachining in manufacturing technology, in particular to an electrochemical-laser mask focusing microetching processing method and device, which are suitable for non-contact etching processing of microstructures of conductive metal materials or semiconductor materials. Background technique [0002] At present, the demand for micro-manufacturing technology of precision MEMS devices is very urgent. The microfabrication technology originating from the semiconductor integrated circuit manufacturing process has not been limited to the silicon wafer exposure and etching technology in the IC process. Electrochemical processing, laser processing and its composite processing technology have also been applied in the field of microfabrication. The electrochemical-laser composite micromachining technology uses the high energy and focus of the laser to reduce the activation energy of the electrode reaction, which can make t...

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Problems solved by technology

The disadvantage of this method is that: the manufacturing precision of the micro-probe electrode will definitely affect the processing of the substrate, and the achieved processing fineness is restricted by the probe electrode; the laser will be blocked by the electrode when it is irradiated from above the probe electrode. The laser can only be irradiated to the gap of the array electrode, but not directly to the processing part of the substrate facing the electrode

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