Temperature circulating test device and heating chip upside-down mounting encapsulation structure using the temperature circulating test device
A test device and temperature cycle technology, which is applied in the direction of measurement device, electronic circuit test, single semiconductor device test, etc., to achieve the effect of small size, improved convenience and high sensitivity
Active Publication Date: 2012-03-28
ADVANCED SEMICON ENG INC
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Problems solved by technology
In this way, the fatigue life of the bumps can be tested on the flip-chip packaging structure at room temperature to solve the problems encountered in the known technology due to the use of a heating furnace to heat the flip-chip packaging structure
Method used
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Embodiment Construction
[0035] figure 1 It is a schematic diagram of a temperature cycle test device according to an embodiment of the present invention. Please refer to figure 1 , the temperature cycle testing device 100 of this embodiment is suitable for heating a flip-chip packaging structure 200 . Wherein, the flip chip packaging structure 200 includes a first substrate 210 , a chip 220 , a first carrier substrate 230 and a plurality of first solder balls 240 . The chip 220 and the first carrier substrate 230 are respectively disposed on an upper surface 212 and a lower surface 214 of the first substrate 210 . The chip 220 is electrically connected to the first substrate 210 in a flip-chip bonding manner. The first solder balls 240 are disposed between the first substrate 210 and the first carrier substrate 230 , and the first substrate 210 and the first carrier substrate 230 are electrically connected by the first solder balls 240 .
[0036] like figure 1 As shown, the flip chip package str...
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The invention relates to a temperature cycling test device suitable for a flip chip packaging structure of a heating chip. The flip chip packaging structure comprises a first substrate, the chip, a first bearing substrate and a plurality of first solder balls; the chip and the first bearing substrate are respectively arranged on the upper surface and the lower surface of the first substrate, wherein, the chip is electrically connected with the first substrate by adoption of flip chip coupling means; the first solder balls are arranged between the first substrate and the first bearing substrate, and the first substrate is connected with the first bearing substrate through the first solder balls. The temperature cycling test device comprises a second substrate, a thermal test chip, a plurality of lugs, a second bearing substrate and a plurality of second solder balls, wherein, the second substrate is provided with an upper surface and a lower surface, the thermal test chip is arranged above the upper surface of the second substrate and attached to the chip; the lugs are arranged between the second substrate and the thermal test chip and electrically connects the second substrate andthe thermal test chip; the second bearing substrate is arranged under the lower surface of the second substrate, and the second solder balls are arranged between the second substrate and the second bearing substrate and electrically connect the second substrate and the second bearing substrate.
Description
technical field [0001] The present invention relates to a temperature cycle testing device and a method for heating a flip-chip packaging structure using the testing device, and in particular to a temperature cycle using a thermal test chip to heat a flip-chip packaging structure to be tested Test device and its heating method. Background technique [0002] With the increase of integrated circuit integration, the chip packaging technology is becoming more and more diversified, because the chip flip chip bonding technology (Flip Chip Interconnect Technology, referred to as FC) has the advantages of reducing the size of the chip package and shortening the signal transmission path. Widely used in the field of chip packaging. The flip-chip bonding technology utilizes an area array to arrange a plurality of bumps on a chip. Then, the chip is flipped, and the plurality of bumps on the chip are electrically and structurally connected to the substrate. [0003] However, since the...
Claims
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IPC IPC(8): H01L21/66H01L23/34H01L23/488G01R31/00G01R31/28G01R31/26
CPCH01L2224/73204
Inventor 钟启生赖逸少叶昶麟
Owner ADVANCED SEMICON ENG INC