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Base plate treating device

A substrate processing device and processing liquid technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as inability to prevent residues, and achieve the effects of preventing defective products from being produced, preventing concentration reduction, and reducing costs

Inactive Publication Date: 2008-11-26
SUMITOMO PRECISION PROD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, if the concentration of the surfactant is lower than a certain reference concentration, the generation of residue cannot be prevented.

Method used

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  • Base plate treating device
  • Base plate treating device

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Embodiment Construction

[0039] Hereinafter, specific embodiments of the present invention will be described based on the drawings. In addition, FIG. 1 is an explanatory diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention.

[0040] As shown in Figure 1, the substrate processing apparatus 1 of this example comprises: the storage tank 11 of storing etching liquid L; Utilize the substrate processing mechanism 12 of etching liquid L to etch substrate K; The first circulation mechanism 20 circulating between them; the removal mechanism 30 that removes the metal dissolved in the etching solution L; the concentration sensor 65 that detects the concentration of the specific component of the etching solution L contained in the etching solution; the etching in the storage tank 11 The supply mechanism 70 for supplying specific components of the liquid L; the substrate processing mechanism 12; the control device 25 for controlling the o...

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Abstract

The invention provides a substrate processing device for preventing the density of the surface active agent included in the processing liquid from reducing due to the regeneration of the processing liquid. The substrate processing device (1) comprises a storage tank (11) for storing the processing liquid containing the surface active agent; a substrate processing mechanism (12) for processing the substrate using the processing liquid; a first cycle mechanism (20) causing the processing liquid in the storage tank (11) to cycle between the storage tank (11) and the substrate processing mechanism (12); adsorbing containers (32, 33) filled with adsorbed materials for adsorbing the metal ion included in the processing liquid due to the substrate process in the substrate processing mechanism (12); a second cycle mechanism (34) for supplying the processing liquid in the storage tank (11) to the adsorbing containers (32, 33) and communicating, wherein the processing liquid which communicates is reclaimed from the adsorbing containers (32, 33) to the storage tank (11), causing the processing liquid to cycle between the storage tank (11) and the adsorbing containers (32, 33); a supplying mechanism (70) for supplying the surface active agent to the processing liquid stored in the storage tank (11) or the processing liquid reclaimed in the storage tank (11) from the adsorbing containers (32, 33).

Description

technical field [0001] The present invention relates to substrate processing comprising a storage tank for storing a processing liquid containing a surfactant, a processing mechanism for processing a substrate with the processing liquid, and a processing liquid circulation mechanism for circulating the processing liquid between the storage tank and the processing mechanism device. Background technique [0002] In the process of manufacturing various substrates such as semiconductor (silicon) wafers, liquid crystal glass substrates, glass substrates for photomasks, and substrates for optical disks, there are various methods of supplying so-called etching solutions, developing solutions, and cleaning solutions to these substrates. Process liquid, the process of processing the substrate. [0003] For example, the processing (etching processing) using an etching solution is carried out by an etching device comprising: a storage tank for storing the etching solution; a substrate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/306H01L21/311C23F1/08
CPCH01L21/6704H01L21/67242
Inventor 中田胜利村田贵田中幸雄柏井俊彦
Owner SUMITOMO PRECISION PROD CO LTD