Production method of label type integration circuit soft plate and structure thereof

Abstract

The invention relates to a production method of tag integrated circuit soft boards and a structure thereof, the method comprises the following steps: a copper foil, an insulating thermal conductive material and a substrate which is coated with an adhesive layer at the surface are firstly taken, the copper foil, the insulating thermal conductive material and the substrate are combined into a continuous strip-shaped or sheet-shaped copper foil soft board by hot pressing; the copper foil is etched by photoetching, a conductive circuit layer which is composed of a plurality of sections of circuits is formed on the surface of the insulating thermal conductive material, and a silver metal layer is plated on the surfaces of the circuits; an electronic part is welded on the circuits and packaged in an external packing body; the copper foil soft board is finally cut, thus forming a plurality of integrated circuit soft boards on the substrate.

Description

Fabrication method and structure of label-type integrated circuit soft board technical field The invention relates to a flexible circuit board, in particular to a manufacturing method and structure of a label-type flexible circuit board. Background technique In the production of traditional light-emitting diodes, a plurality of connected lead frames are punched out on a strip or sheet copper metal plate, and then resin injection or hot pressing is used to form a seat body on each lead frame. The body has a cavity that can expose the lead frame, and then carry out crystal bonding and gold wire bonding on the lead frame in the cavity. After the crystal bonding and connecting gold wires are completed, fluorescent glue and epoxy resin to form light emitting diodes. After the light-emitting diodes are manufactured, the lead frame will be cut to separate the light-emitting diodes from the frame of the lead frame to form single light-emitting diodes. When packing the light-emi...

AI Technical Summary

Problems solved by technology

Before the subsequent processing and assembly of such small circuit boards, the small circuit boards are randomly stacked and stored in a collection box or squeezed in a packaging bag, which causes the circuit boards to be squeezed each other, resulting in SMD The electronic parts and the circuits on the circuit board are separated or have poor contact, resulting in many defective products in subsequent production.

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